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参数资料
| 型号： | V18MLA0603 |
| 厂商： | Littelfuse, Inc. |
| 英文描述： | Multilayer Transient Voltage Surge Suppressors |
| 中文描述： | 多层瞬态电压浪涌抑制器 |
| 文件页数： | 10/11页 |
| 文件大小： | 254K |
| 代理商： | V18MLA0603 |
Soldering Recommendations
The principal techniques used for the soldering of components in surface
mount technology are Infrared (IR) re-flow, vapour phase re-flow and wave
soldering. Typical profiles are shown in Figures 14, 15 and 16. When wave
soldering, the ML suppressor is attached to the circuit board by means of an
adhesive. The assembly is then placed on a conveyor and run through the
soldering process to contact the wave. With IR and vapour phase reflow; the
device is placed in a solder paste on the substrate. As the solder paste is
heated, it re-flows and solders the unit to the board.
The recommended solder for the ML suppressor is a 62/36/2 (Sn/Pb/Ag),
60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends an RMA
solder flux.
Wave soldering is the most strenuous of the processes. To avoid the
possibility of generating stresses due to thermal shock, a preheat stage
in the soldering process is recommended, and the peak temperature of
the solder process should be rigidly controlled. For 0402 size devices, IR
re-flow is recommended.
When using a reflow process, care should be taken to ensure that the ML
chip is not subjected to a thermal gradient steeper than 4 degrees per
second; the ideal gradient being 2 degrees per second. During the
soldering process, preheating to within 100 degrees of the solder’s peak
temperature is essential to minimize thermal shock. Examples of the
soldering conditions for the ML suppressor are given in the tables below.
Once the soldering process has been completed, it is still necessary
to ensure that any further thermal shocks are avoided. One possible
cause of thermal shock is hot printed circuit boards being removed
from the solder process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually to less than
50oC before cleaning.
Termination Options
Littelfuse offers three types of electrode termination finish for the
Multilayer product series:
1. Silver/Platinum (standard, not available for 0402)
2. Silver/Palladium (optional)
(The ordering information section describes how to designate them.)
FIGURE 14. REFLOW SOLDER PROFILE
FIGURE 15. WAVE SOLDER PROFILE
FIGURE 16. VAPOR PHASE SOLDER PROFILE
TEMPERA
TURE
(
o
C)
TIME (MINUTES)
300
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
MAXIMUM WAVE 260 oC
SECOND PREHEAT
FIRST PREHEAT
TEMPERA
TURE
(
o
C)
TIME (MINUTES)
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
RAMP RATE
PREHEAT ZONE
>50oC/s
MAXIMUM
TEMPERATURE 222oC
40-80
SECONDS
ABOVE 183 oC
TEMPERA
TURE
(
o
C)
TIME (MINUTES)
250
200
150
100
50
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
MAXIMUM
PREHEAT DWELL
PREHEAT ZONE
TEMPERATURE 222oC
RAMP RATE
<2oC/s
40-80
SECONDS
ABOVE 183 oC
ML Varistor Series
Surface Mount Varistors
Multilayer Transient Voltage Surge Suppressors
147
www .littelfuse .com
3
SURF
A
CE
MOUNT
V
ARIST
ORS
3. Nickel Barrier (optional for 0402-1210 package size)
(The ordering information section describes how to designate them.)
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相关代理商/技术参数 |
参数描述 |
|---|---|
| V18MLA0603A | 功能描述:压敏电阻 14V 30A 125pF RoHS:否 制造商:EPCOS 产品:MLV 电压额定值 DC:22 V 电压额定值 AC:17 V 钳位电压:50 V 直径: 峰值浪涌电流:30 A 浪涌能量额定值:75 mJ 电容:74.2 pF 工作温度范围:- 55 C to + 125 C 安装:SMD/SMT 封装:Reel |
| V18MLA0603H | 功能描述:压敏电阻 14V 30A 125pF RoHS:否 制造商:EPCOS 产品:MLV 电压额定值 DC:22 V 电压额定值 AC:17 V 钳位电压:50 V 直径: 峰值浪涌电流:30 A 浪涌能量额定值:75 mJ 电容:74.2 pF 工作温度范围:- 55 C to + 125 C 安装:SMD/SMT 封装:Reel |
| V18MLA0603N | 制造商:LITTELFUSE 制造商全称:Littelfuse 功能描述:Surface Mount Multilayer Varistors (MLVs) |
| V18MLA0603NA | 功能描述:压敏电阻 14V 30A 125pF RoHS:否 制造商:EPCOS 产品:MLV 电压额定值 DC:22 V 电压额定值 AC:17 V 钳位电压:50 V 直径: 峰值浪涌电流:30 A 浪涌能量额定值:75 mJ 电容:74.2 pF 工作温度范围:- 55 C to + 125 C 安装:SMD/SMT 封装:Reel |
| V18MLA0603NH | 功能描述:压敏电阻 14V 30A 125pF RoHS:否 制造商:EPCOS 产品:MLV 电压额定值 DC:22 V 电压额定值 AC:17 V 钳位电压:50 V 直径: 峰值浪涌电流:30 A 浪涌能量额定值:75 mJ 电容:74.2 pF 工作温度范围:- 55 C to + 125 C 安装:SMD/SMT 封装:Reel |
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