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| 型号： | V23026A1002B201 |
| 厂商： | TE Connectivity |
| 文件页数： | 4/5页 |
| 文件大小： | 0K |
| 描述： | RELAY GEN PURPOSE SPDT 1A 12V |
| 产品目录绘图： | V23026 Thru Hole Series V23026 Thru Hole Series Circuit V23026 Thru Hole Series Footprint |
| 特色产品： | Plug-In Relays |
| 3D 型号： | 1393774-8.pdf |
| 标准包装： | 40 |
| 系列： | V23026, AXICOM |
| 继电器类型： | 通用 |
| 线圈类型： | 无锁存 |
| 线圈电流： | 5.3mA |
| 线圈电压： | 12VDC |
| 触点形式： | SPDT（1 C 型） |
| 触点额定值（电流）： | 1A |
| 切换电压： | 150VAC，125VDC - 最小值 |
| 关闭电压（最大）： | 9 VDC |
| 关闭电压（最小）： | 1.2 VDC |
| 安装类型： | 通孔 |
| 端接类型： | PC 引脚 |
| 包装： | 管件 |
| 触点材料： | 钯镍（PdNi），铑（Rh），金（Au） |
| 操作时间： | 2ms |
| 释放时间： | 2ms |
| 线圈功率： | 34 mW |
| 线圈电阻： | 2.25 千欧 |
| 工作温度： | -40°C ~ 85°C |
| 产品目录页面： | 2614 (CN2011-ZH PDF) |
| 其它名称： | 1393774-8 PB283 |
P1 V23026 Relay
AXICOM
Packing
Soldering conditions according IEC 60058-2-58 and
Recommended Soldering Conditions Relays
Signal
AXICOM
AXICOM
P1 V23026 Relay
AXICOM
Soldering conditions according IEC 60058-2-58 Relay V23026 (Continued)
P1 V23026 Relay
IPC/JEDEC J-STD-020B
Recommended Soldering Conditions limits
Packing
Packing
Soldering conditions according IEC
60058-2-58 and limits
Recommended soldering conditions
IPC/JEDEC J-STD-020B
100 °C
RecommendedSolderingConditions
IPC/JEDEC J-STD-020B T elecom-, Signal and RF Relays
Dotted line: process
240 °C
Processing Packing
20 - 40 sec Full line: typical
Dotted line: process
240
180 °C
130°C
Soldering conditions according IEC 60058-2-58 and forced Tube for THT version
IPC/JEDEC J-STD-020B cooling 40 relays per tube, 2000 relays per box
180 °C
P1 V23026 Relay
T elecom-, Signal and RF Relays 108-98009 Rev. E
T elecom-, Signal and RF Relays
20 - 40 sec Full line: typical P1 V23026 Relay
T ube for
40 relays
2‘000 re
130 °C
240 °C
100 °C
20 - 40 sec
Full line: typical
forced
Dotted line: process limits
cooling
180 °C
130 °C
100 °C
Resistance to soldering heat - Re ow pro le
forced
cooling
V apor Phase Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
V apor Phase Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
Resistance to soldering heat - Re ow pro le
Vapor Phase Soldering:
temperature/time profile (lead
Resistance to soldering heat - Reflow profile and housing peak temperature)
Tape and reel for SMT
V apor Phase Soldering: T emperature/ T ime Pro?le
(Lead and Housing version Peak T emperature)
per
480 relays 11.6±0.2 reel, 2400 relays per box
T ape and
480 rela
2‘400 pe
Resistance to soldering heat - Re ow pro le
11.6±0.2
Reel dimension
Recommended re ow soldering pro le
Recommended reflow ow soldering pro le
Recommended soldering profile
Infrared Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
re
Time (s)
Time (s)
Time (s)
Infrared Soldering: temperature/
time profile (lead and housing
peak temperature)
Infrared Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
Reel dimension
11.6±0.2
Reel dimensions
Reel and
Infrared Soldering: T emperature/ T ime Pro?le
(Lead dimension Housing Peak T emperature)
Reel dimension
Recommended re ow soldering pro le
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
Time (s)
Time (s)
Infrared Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
Infrared Soldering: T emperature/ T ime Pro?le
(Lead and Housing Peak T emperature)
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
Time (s) Infrared Soldering: T emperature/ T ime Pro?le
(Leadand subjectto T TycoElectronics
All speci?cations Housing change. Peak Consult emperature) for latest speci?cations.
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations. 9 of 12
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
4
02-2012, Rev. 0212 Datasheets and product specification Datasheets and product data is subject to the
www.te.com according to IEC 61810-1 and to be used terms of the disclaimer and all chapters of
? 2011 Tyco Electronics Corporation, only together with the ‘Definitions’ section. the ‘Definitions’ section, available at
a TE Connectivity Ltd. company http://relays.te.com/definitions
All speci?cations subject to change. Consult T yco Electronics for latest speci?cations.
9 of 12
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
9 of 12
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相关代理商/技术参数 |
参数描述 |
|---|---|
| V23026-A1002-B201 | 制造商:TE Connectivity 功能描述:RELAY PCB SPCO 12VDC 制造商:TE Connectivity 功能描述:RELAY, PCB, SPCO, 12VDC |
| V23026-A1002-B201 | 制造商:TE Connectivity 功能描述:RELAY PCB SPCO 12VDC |
| V23026A1003B201 | 功能描述:低信号继电器 - PCB RoHS:否 制造商:NEC 触点形式:2 Form C (DPDT-BM) 触点电流额定值: 线圈电压:5 V 最大开关电流:1 A 线圈电流:1 A 线圈类型:Non-Latching 功耗:140 mW 端接类型:SMT 绝缘: 介入损耗: |
| V23026-A1003-B201 | 制造商:Tyco Electronics 功能描述:Bulk |
| V23026A1004B201 | 功能描述:低信号继电器 - PCB 24VDC Non-latching Single coil P1 RoHS:否 制造商:NEC 触点形式:2 Form C (DPDT-BM) 触点电流额定值: 线圈电压:5 V 最大开关电流:1 A 线圈电流:1 A 线圈类型:Non-Latching 功耗:140 mW 端接类型:SMT 绝缘: 介入损耗: |
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