参数资料
型号: V2DIP2-64
厂商: FTDI, Future Technology Devices International Ltd
文件页数: 2/24页
文件大小: 0K
描述: MOD VINCULUM-II DEV 2 PORT 64DIP
标准包装: 5
系列: Vinculum-II
主要目的: 接口,USB 2.0 主机/控制器
嵌入式: 是,ASIC
已用 IC / 零件: VNC2-64Q
主要属性: 双路 A 型连接器,UART / 并行 FIFO / SPI 接口
次要属性: LED 状态指示器
已供物品:
产品目录页面: 634 (CN2011-ZH PDF)
相关产品: 768-1052-ND - MOD VINCULUM-II DEBUGGR/PROGRAMR
其它名称: 768-1053
Document Reference No.: FT_000166
V2DIP2-64 VNCL2-64Q Development Module Datasheet Version 1.01
Clearance No.: FTDI# 155
`
1
Introduction
V2DIP2-64 module is designed to allow rapid development of designs using the VNC2-64Q IC. The
V2DIP2-64 is supplied as a PCB designed to fit into a 60 pin 0.8” wide, 0.1 ” pitch DIP socket .The module
provides access to the UART, parallel FIFO, and SPI interface pins of the VNC2-64Q device, via its IO bus
pins. Two USB ports are accessed via type A USB connectors.
Figure 1.1 - V2DIP2-64
The VNC2 is one of the family of Vinculum devices from FTDI : the second of FTDI ’ s Vinculum family of
Embedded dual USB host controller integrated circuit devices. The device is capable of handling the USB
Host Interface for a variety of different USB device classes, e.g. BOMS (bulk only mass storage), Printer,
HID (human interface device) etc. When interfacing to mass storage devices such as USB Flash drives,
VNC2 also transparently handles the FAT File structure.
Communication with non USB devices such as a low cost microcontroller is accomplished via either UART,
SPI or parallel FIFO interfaces using a simple to implement command set. VNC2 provides a new cost
effective solution for providing USB Host capability into products that previously did not have the
hardware resources available.
The device comes with a Debugger interface with bus master functionality and suite of tools which allows
customers to create their own firmware (Compiler – Linker – Debugger – Assembler – IDE).
The Vinculum-II VNC2 family of devices are available in Pb-free (RoHS compliant) 32-lead LQFP, 32-lead
QFN, 48-lead LQFP, 48-lead QFN, 64-Lead lQFP and 64-lead QFN packages
Copyright ? 2010 Future Technology Devices International Limited
1
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