参数资料
| 型号： | V5.5MLA020133NR |
| 厂商： | Littelfuse Inc |
| 文件页数： | 2/3页 |
| 文件大小： | 0K |
| 描述： | VARISTOR ESD 5.5V 33PF SMD 0201 |
| 产品培训模块： | Metal Oxide Varistors |
| 标准包装： | 1 |
| 系列： | MLA |
| 变阻器电压： | 14V |
| 电流 - 浪涌： | 1A |
| 电路数： | 1 |
| 最大交流电压： | 4VAC |
| 最大直流电压： | 5.5VDC |
| 封装/外壳： | 0201（0603 公制） |
| 产品目录页面： | 2353 (CN2011-ZH PDF) |
| 其它名称： | F3493DKR |
Varistor Products
Surface Mount Multilayer Varistors (MLVs) > 0201 MLA Series
Reliability and Environmental Speci?cations
Judge Criteria
Test Condition
Solderability
Leaching Resistance
High Temperature Exposure
Thermal Shock
Operating Life
Bias Humidity
> 95% solder coverage
> 95% solder coverage
Δ Vv / Vv < 10%
Δ Vv / Vv < 10%
Δ Vv / Vv < 10%
Δ Vv / Vv < 10%
245 +/- oC, 3 +/- 1 sec.
245 +/- oC, 3 +/- 1 sec.
1000 hours 85oC, un-powered
-45 to +85 oC, 30 min. cycle, 5 cycles
85 oC, DC working voltage 1000 hours
40 oC / 85% RH, DC working voltage 1000 hours
Peak Pulse Current Test Waveform for Clamping Voltage
100
50
Lead–free (Pb-free) Soldering Recommendations
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a re?ow process, care should be taken to
ensure that the ML chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
O 1
0
T
TIME
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
T 1
T 2
0 1 = Virtual Origin of Wave
T = Time from 10% to 90% of Peak
T 1 = Rise Time = 1.25 x T
T 2 = Decay Time
Example - For an 8/20 μ s Current Waveform:
8 μ s = T 1 = Rise Time
20 μ s = T 2 = Decay Time
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50o C before cleaning.
Multilayer Internal Construction
300
250
MAXIMUM TEMPERATURE 260?C,
TIME WITHIN 5?C OF PEAK
20 SECONDS MAXIMUM
RAMP RATE
FIRED CERAMIC
DIELECTRIC
200
<3?C/s
60 - 150 SEC
> 217?C
150
100
PREHEAT ZONE
METAL END
METAL
ELECTRODES
50
TERMINATION
0
0
1.0
2.0
3.0
4.0
5.0
6.0
7.0
DEPLETION
REGION
DEPLETION
REGION
GRAINS
TIME (MINUTES)
0201 MLA Varistor Series
Revision: June 28, 2010
?2010 Littelfuse, Inc.
Speci?cations are subject to change without notice.
Please refer to www.littelfuse.com/series/0201MLA.html for current information.
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