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参数资料
| 型号： | VCC1-B3F-13M07 |
| 厂商： | VECTRON INTERNATIONAL |
| 元件分类： | XO, clock |
| 英文描述： | VCXO, CLOCK, 13.07 MHz, CMOS OUTPUT |
| 文件页数： | 9/10页 |
| 文件大小： | 168K |
| 代理商： | VCC1-B3F-13M07 |
VCC1 Data sheet
Vectron International 267 Lowell Rd, Hudson NH 03051
Tel: 1-88-VECTRON-1
e-mail: vectron@vectron.com
Reliability
The VCC1 qualification tests have included:
Table 7. Environnemental Compliance
Parameter
Conditions
Mechanical Shock
MIL-STD-883 Method 2022
Mechanical Vibration
MIL-STD-883 Method 2007
Temperature Cycle
MIL-STD-883 Method 1010
Solderability
MIL-STD-883 Method 2003
Gross and Fine Leak
MIL-STD-883 Method 1014
Resistance to Solvents
MIL-STD-883 Method 2015
Handling Precautions
Although ESD protection circuitry has been designed into the the VCC1, proper precautions should be taken
when handling and mounting. VI employs a Human Body Model and a Charged-Device Model (CDM) for
ESD susceptibility testing and design protection evaluation. ESD thresholds are dependent on the circuit
parameters used to define the model. Although no industry wide standard has been adopted for the CDM, a
standard HBM of resistance = 1.5kohms and capacitance = 100pF is widely used and therefore can be
used for comparison purposes.
Table 8. ESD Ratings
Model
Minimum
Conditions
Human Body Model
1000
MIL-STD-883 Method 3115
Charged Device Model
1500
JESD 22-C101
Suggested IR profile
Devices are built using lead free epoxy and can also be subjected to standard lead free IR reflow conditions,
Table 9 shows max temperatures and lower temperatures can also be used e.g. peak temperature of 220C.
Table 9. Reflow Profile (IPC/JEDEC J-STD-020B)
Parameter
Symbol
Value
Preheat Time
t S
150 sec Min, 200 sec Max
Ramp Up
R UP
3
oC/sec Max
Time Above 217
oC
t L
60 sec Min, 150 sec Max
Time To Peak Temperature
t AMB-P
480 sec Max
Time At 260
oC (max)
t P
10 sec Max
Time At 240 °C (max)
tp2
60 sec Max
Ramp Down
R DN
6
oC/sec Max
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