参数资料
型号: VJ0805Y102KXBBC31
厂商: Vishay Vitramon
文件页数: 18/21页
文件大小: 0K
描述: CAP CER 1000PF 100V 10% X7R 0805
特色产品: Automotive Multilayer Ceramic Chip Capacitors
标准包装: 1
系列: VJ
电容: 1000pF
电压 - 额定: 100V
容差: ±10%
温度系数: X7R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 150°C
应用: 自动
额定值: AEC-Q200
封装/外壳: 0805(2012 公制)
尺寸/尺寸: 0.079" L x 0.049" W(2.00mm x 1.25mm)
厚度(最大): 0.057"(1.45mm)
包装: 标准包装
其它名称: 720-1264-6
VJ....31/VJ....34 Automotive MLCC
www.vishay.com
6 - BOARD FLEX TEST CONDITIONS
6.1 BOARD FLEX DEFINITIONS OF TEST
PCB thickness = (1.6 ± 0.1) mm
Copper thickness = 35 μm
Material FR4 (EP-GC 02 according to DIN 40 802)
LAYOUT/PAD DESIGN (Dimensions in mm)
Vishay Vitramon
CASE CODE
0603
0805
1206
1210
1812
LL
2.20
3.40
4.50
4.50
4.75
PAD SIZE
LB
1.00
1.30
1.80
2.80
3.60
LEL
0.75
1.20
1.20
1.30
1.50
Note
? LL = total length; LB = width of the pad; LEL = single pad length
LEL
LL
6.2 SOLDERING INSTRUCTIONS
THICKNESS, RECOMMENDED FOR SOLDER PASTE (Reflow soldering)
CASE CODE
0402
0603
0805
1206
1210
1812
THICKNESS in μm
75 to 90
150 to 200
150 to 200
150 to 200
150 to 200
150 to 200
6.3 TYPICAL TEMPERATURE PROFILE FOR REFLOW SOLDERING (Boardflex test)
LEAD (Pb)-FREE S OLDERIN G PROFILE
3 00
MIN. 3 00 s
MAX. 260 °C
MIN. 255 °C
250
T ( S OLID) MIN. 217 °C
200
MIN. 190 °C
MIN. 40 s
150
MIN. 90 s
100
50
RAMP UP
TO 150 °C
MAX. 3 K/s
MIN. 110 s
RAMP DOWN
FROM T ( S OLID)
MAX. 6 K/s
0
0
50
100
150
200
250
3 00
3 50 400
TIME (s)
Revision: 12-Feb-14
18
Document Number: 45040
For technical questions, contact: mlcc@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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