参数资料
型号: VNC2-64L1B-REEL
厂商: FTDI, Future Technology Devices International Ltd
文件页数: 80/88页
文件大小: 0K
描述: IC USB HOST/DEVICE CTRL 64-LQFP
应用说明: Vinculum-II IO Cell Description AppNote
Vinculum-II Debug Interface Description AppNote
Vinculum-II IO Mux Explained AppNote
Vinculum-II PWM Example AppNote
Migrating Vinculum Designs AppNote
特色产品: Vinculum VNC2
标准包装: 1
系列: Vinculum-II
控制器类型: USB 2.0 控制器
接口: USB,主机/设备配置,UART,SPI,PWM,闪存 256K,DMA 4CH
电源电压: 1.62 V ~ 1.98 V
电流 - 电源: 25mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 64-LQFP
供应商设备封装: 64-LQFP(10x10)
包装: 标准包装
产品目录页面: 634 (CN2011-ZH PDF)
其它名称: 768-1047-6
81
Copyright 2009-2011 Future Technology Devices International Limited
Datasheet
Vinculum-II Embedded Dual USB Host Controller IC
Version 1.5
Document No.: FT_000138 Clearance No.: FTDI# 143
Profile Feature
Pb Free Solder Process
(green material)
SnPb Eutectic and Pb free (non
green material) Solder Process
Average Ramp Up Rate (Ts to Tp)
3°C / second Max.
3°C / Second Max.
Preheat:
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
150°C
200°C
60 to 120 seconds
100°C
150°C
60 to 120 seconds
Time Maintained Above Critical
Temperature TL:
- Temperature (TL)
- Time (tL)
217°C
60 to 150 seconds
183°C
60 to 150 seconds
Peak Temperature (Tp)
260°C
Time within 5°C of actual Peak
Temperature (tp)
30 to 40 seconds
20 to 40 seconds
Ramp Down Rate
6°C / second Max.
Time for T= 25°C to Peak Temperature, Tp
8 minutes Max.
6 minutes Max.
Table 11.1 Reflow Profile Parameter Values
SnPb Eutectic and Pb free (non green material)
Package Thickness
Volume mm3 < 350
Volume mm3 >=350
< 2.5 mm
235 +5/-0 °C
220 +5/-0 °C
≥ 2.5 mm
220 +5/-0 °C
Pb Free (green material) = 260 +5/-0 °C
Table 11.2 Package Reflow Peak Temperature
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VNC2-64L1B-TRAY 功能描述:USB 接口集成电路 Vinculum-II Dual Host/Dev IC LQFP-64 RoHS:否 制造商:Cypress Semiconductor 产品:USB 2.0 数据速率: 接口类型:SPI 工作电源电压:3.15 V to 3.45 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:WLCSP-20
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