参数资料
| 型号： | VO3526 |
| 厂商： | Vishay Semiconductors |
| 文件页数： | 2/8页 |
| 文件大小： | 0K |
| 描述： | PHOTOTRAIC 600V 1A DIP10(16) |
| 特色产品： | Power Phototriacs |
| 标准包装： | 1,000 |
| 电压 - 隔离： | 5300Vrms |
| 通道数： | 1 |
| 电压 - 断路： | 600V |
| 输出类型： | AC，三端双向可控硅，电源 |
| 电流 - 栅极触发电流 (Igt)（最大）： | 10mA |
| 电流 - 保持 (Ih)： | 25mA |
| 电流 - DC 正向(If)： | 50mA |
| 电流 - 输出 / 通道： | 1A |
| 安装类型： | 通孔 |
| 封装/外壳： | 16-DIP（0.300"，7.62mm），10 引线 |
| 供应商设备封装： | 10-DIP |
| 包装： | 管件 |
VO3526
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS (T amb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
COUPLER
Total power dissipation
Ambient temperature range
Storage temperature range
P diss
T amb
T stg
1.2
- 40 to + 85
- 40 to + 125
W
°C
°C
Soldering temperature (1)
Isolation test voltage
t ≤ 10 s max.
for 1.0 s
T sld
V ISO
260
5300
°C
V RMS
Notes
? Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. Functional operation of the device is not
implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute
maximum ratings for extended periods of the time can adversely affect reliability.
(1) Refer to wave profile for soldering conditions for through hole devices.
(2) Total power dissipation value is based on 2S2P PCB. Refer to power phototriac application note for PCB design tips.
ABSOLUTE MAXIMUM RATING CURVES
80
1.2
1.0
60
0.8
40
0.6
0.4
20
0.2
0
- 40 - 20
0
20
40
60
80 100 120
0
- 40 - 20
0
20
40
60
80 100 120
21296
T A - Ambient Temperature (°C)
21502
Ambient Temperature (°C)
Fig. 1 - Power Dissipation vs. Temperature
Fig. 2 - Allowable Load Current vs. Ambient Temperature
Note
? The allowable load current was calculated out under a given
operating conditions and only for reference:
LED power: Q E = 0.015 W, θ BA (4-layer) = 30 °C/W
THERMAL CHARACTERISTICS
PARAMETER
Maximum LED junction temperature
Maximum NOT junction temperature
Thermal resistance, junction NOT to bord
Thermal resistance, junction NOT to case
Thermal resistance, junction OT to board
Thermal resistance, junction OT to case
Thermal resistance, junction emitter to board
Thermal resistance, junction emitter to case
Thermal resistance, junction NOT to junction OT
Thermal resistance, junction emitter to junction NOT
Thermal resistance, junction emitter to junction OT
Thermal resistance, case to ambient
SYMBOL
T jmax.
T jmax.
θ NOT-B
θ NOT-C
θ OT-B
θ OT-C
θ E-B
θ E-C
θ NOT-OT
θ E-NOT
θ E-OT
θ CA
VALUE
105
105
75
150
158
157
149
161
243
420
235
130
UNIT
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Note
? The thermal model is represented in the thermal network below. Each resistance value given in this model can be used to calculate the
temperatures at each node for a given operating condition. The thermal resistance from board to ambient will be dependent on the type of
PCB, layout and thickness of copper traces. For a detailed explanation of the thermal model, please reference Vishay's Thermal
Characteristics of Power Phototriac application note.
Rev. 1.3, 24-Sep-12
2
Document Number: 81842
For technical questions, contact: optocoupler.answers@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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