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参数资料
型号： W19B160BTBAM
厂商： WINBOND ELECTRONICS CORP
元件分类： PROM
英文描述： 1M X 16 FLASH 2.7V PROM, 10 ns, PBGA48
封装： 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-48
文件页数： 1/48页
文件大小： 534K
代理商： W19B160BTBAM
W19B160BT/B DATA SHEET
Publication Release Date:Jan.04, 2008
- 1 -
Revision A5
-Table of Contents-
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATIONS ............................................................................................................ 6
4.
BLOCK DIAGRAM ...................................................................................................................... 7
5.
PIN DESCRIPTION..................................................................................................................... 8
6.
FUNCTIONAL DESCRIPTION ................................................................................................... 9
6.1
DEVICE BUS OPERATION............................................................................................ 9
6.1.1
Word/Byte Configuration...................................................................................................9
6.1.2
Reading Array Data ..........................................................................................................9
6.1.3
Writing Commands/Command Sequences.......................................................................9
6.1.4
Program and Erase Operation Status...............................................................................9
6.1.5
Standby Mode ..................................................................................................................9
6.1.6
Automatic Sleep Mode ...................................................................................................10
6.1.7
#RESET: Hardware Reset Pin........................................................................................10
6.1.8
Output Disable Mode......................................................................................................10
6.1.9
Auto-select Mode............................................................................................................10
6.1.10
Sector Protection and Un-protection.............................................................................11
6.1.11
Temporary Sector Unprotect ........................................................................................11
6.1.12
Hardware Data Protection ............................................................................................11
6.1.13
Write Pulse “Glitch” Protection......................................................................................11
6.1.14
Logical Inhibit................................................................................................................11
6.1.15
Power-Up Write Inhibit..................................................................................................11
6.2
COMMAND DEFINITIONS ........................................................................................... 12
6.2.1
Reading Array Data ........................................................................................................12
6.2.2
Reset Command.............................................................................................................12
6.2.3
Auto-select Command Sequence ...................................................................................12
6.2.4
Byte/Word Program Command Sequence......................................................................13
6.2.5
Chip Erase Command Sequence ...................................................................................13
6.2.6
Sector Erase Command Sequence ................................................................................13
6.2.7
Erase Suspend /Erase Resume Commands ..................................................................14
6.2.8
Unlock Bypass Command Sequence .............................................................................14
6.3
WRITE OPERATION STATUS..................................................................................... 15
6.3.1
DQ7: #Data Polling.........................................................................................................15
6.3.2
RY/#BY: Ready/#Busy....................................................................................................15
相关PDF资料
PDF描述
W19B160BBTAH 1M X 16 FLASH 2.7V PROM, 10 ns, PDSO48
W19B160BTTBH 1M X 16 FLASH 2.7V PROM, 11 ns, PDSO48
W19B160BBT7H 1M X 16 FLASH 2.7V PROM, 70 ns, PDSO48
W19B320ABB8G 2M X 16 FLASH 3V PROM, 70 ns, PBGA48
W19B320ABBAM 2M X 16 FLASH 3V PROM, 70 ns, PBGA48
相关代理商/技术参数
参数描述
W19B160BTBH7H 制造商:WINBOND 制造商全称:Winbond 功能描述:16Mbit, 2.7~3.6 volt CMOS flash memory
W19B160BTBM7H 制造商:WINBOND 制造商全称:Winbond 功能描述:16Mbit, 2.7~3.6 volt CMOS flash memory
W19B160BTT7H 制造商:WINBOND 制造商全称:Winbond 功能描述:2.7~3.6-volt write (program and erase) operations, Fast write operation
W19B160TB7H7H 制造商:WINBOND 制造商全称:Winbond 功能描述:16Mbit, 2.7~3.6 volt CMOS flash memory
W19B160TB7M7H 制造商:WINBOND 制造商全称:Winbond 功能描述:16Mbit, 2.7~3.6 volt CMOS flash memory
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