收藏本站
参数资料
型号： W19B320ABBBG
厂商： WINBOND ELECTRONICS CORP
元件分类： PROM
英文描述： 2M X 16 FLASH 3V PROM, 70 ns, PBGA48
封装： 6 X 8 MM, 0.80 MM PITCH, TFBGA-48
文件页数： 1/53页
文件大小： 479K
代理商： W19B320ABBBG
W19B320AT/B Data Sheet
4M
× 8/2M × 16 BITS
3V FLEXIBLE BANK FLASH MEMORY
Publication Release Date: December 27, 2005
- 1 -
Revision A4
Table of Contents-
1.
GENERAL DESCRIPTION ......................................................................................................... 4
2.
FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATIONS ............................................................................................................ 5
4.
BLOCK DIAGRAM ...................................................................................................................... 6
5.
PIN DESCRIPTION..................................................................................................................... 6
6.
FUNCTIONAL DESCRIPTION ................................................................................................... 7
6.1
Device Bus Operation..................................................................................................... 7
6.1.1
Word/Byte Configuration ..................................................................................................7
6.1.2
Reading Array Data ..........................................................................................................7
6.1.3
Writing Commands/Command Sequences.......................................................................7
6.1.4
Simultaneous Read/Write Operations with Zero Latency .................................................8
6.1.5
Standby Mode ..................................................................................................................8
6.1.6
Automatic Sleep Mode .....................................................................................................8
6.1.7
#RESET: Hardware Reset Pin..........................................................................................9
6.1.8
Output Disable Mode........................................................................................................9
6.1.9
Autoselect Mode...............................................................................................................9
6.1.10
Sector/Sector Block Protection and Unprotection...........................................................9
6.1.11
Write Protect (#WP) .....................................................................................................10
6.1.12
Temporary Sector Unprotect ........................................................................................10
6.1.13
Security Sector Flash Memory Region .........................................................................10
6.1.14
Hardware Data Protection ............................................................................................11
6.2
Command Definitions ................................................................................................... 12
6.2.1
Reading Array Data ........................................................................................................12
6.2.2
Reset Command.............................................................................................................12
6.2.3
AUTOSELECT Command Sequence .............................................................................13
6.2.4
Byte/Word Program Command Sequence......................................................................13
6.2.5
Unlock Bypass Command Sequence .............................................................................14
6.2.6
Chip Erase Command Sequence ...................................................................................14
6.2.7
Sector Erase Command Sequence ................................................................................14
6.2.8
Erase Suspend/Erase Resume Commands ...................................................................15
6.3
Write Operation Status ................................................................................................. 16
6.3.1
DQ7: #Data Polling.........................................................................................................16
6.3.2
RY/#BY: Ready/#Busy ...................................................................................................16
6.3.3
DQ6: Toggle Bit I............................................................................................................16
相关PDF资料
PDF描述
W25X20-VSSI-G 2M X 1 FLASH 2.7V PROM, PDSO8
WS-512K8-70PI 512K X 8 MULTI DEVICE SRAM MODULE, 70 ns, DMA32
WS512K32-85G4TQ 2M X 8 MULTI DEVICE SRAM MODULE, 85 ns, CQFP68
WMS512K8B-25FECEA 512K X 8 STANDARD SRAM, 25 ns, CDFP32
WMS512K8B-25FEIE 512K X 8 STANDARD SRAM, 25 ns, CDFP32
相关代理商/技术参数
参数描述
W19B320ABT7H 功能描述:IC FLASH 32MBIT 70NS 48TSOP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:移动 SDRAM 存储容量:256M（8Mx32） 速度:133MHz 接口:并联 电源电压:1.7 V ~ 1.95 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:带卷 (TR) 其它名称:557-1327-2
W19B320ATB 制造商:WINBOND 制造商全称:Winbond 功能描述:4M × 8/2M × 16 BITS 3V FLEXIBLE BANK FLASH MEMORY
W19B320ATB7H 功能描述:IC FLASH 32MBIT 70NS 48TFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:移动 SDRAM 存储容量:256M（8Mx32） 速度:133MHz 接口:并联 电源电压:1.7 V ~ 1.95 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:带卷 (TR) 其它名称:557-1327-2
W19B320ATT7H 功能描述:IC FLASH 32MBIT 70NS 48TSOP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:移动 SDRAM 存储容量:256M（8Mx32） 速度:133MHz 接口:并联 电源电压:1.7 V ~ 1.95 V 工作温度:-40°C ~ 85°C 封装/外壳:90-VFBGA 供应商设备封装:90-VFBGA（8x13） 包装:带卷 (TR) 其它名称:557-1327-2
W19B320B 制造商:WINBOND 制造商全称:Winbond 功能描述:32Mbit, 2.7~3.6-volt single bank CMOS flash memory
发布紧急采购，3分钟左右您将得到回复。

采购需求

(若只采购一条型号，填写一行即可)

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

发布成功！您可以继续发布采购。也可以进入我的后台，查看报价

*型号 *数量 厂商 批号 封装
添加更多采购

我的联系方式

*
*
*