参数资料
型号: W19B320ATT9M
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 2M X 16 FLASH 3V PROM, 70 ns, PDSO48
封装: 12 X 20 MM, LEAD FREE, TSOP-48
文件页数: 17/53页
文件大小: 479K
代理商: W19B320ATT9M
W19B320AT/B
- 24 -
Top Boot Sector/Sector Block Address for Protection/Unprotection
SECTOR
A20-A12
SECTOR/SECTOR BLOCK SIZE
SA0
000000XXX
64 K bytes
SA1-SA3
000001XXX
000010XXX
000011XXX
192 (3x64) K bytes
SA4-SA7
0001XXXXX
256(4x64) K bytes
SA8-SA11
0010XXXXX
256(4x64) K bytes
SA12-SA15
0011XXXXX
256(4x64) K bytes
SA16-SA19
0100XXXXX
256(4x64) K bytes
SA20-SA23
0101XXXXX
256(4x64) K bytes
SA24-SA27
0110XXXXX
256(4x64) K bytes
SA28-SA31
0111XXXXX
256(4x64) K bytes
SA32-SA35
1000XXXXX
256(4x64) K bytes
SA36-SA39
1001XXXXX
256(4x64) K bytes
SA40-SA43
1010XXXXX
256(4x64) K bytes
SA44-SA47
1011XXXXX
256(4x64) K bytes
SA48-SA51
1100XXXXX
256(4x64) K bytes
SA52-SA55
1101XXXXX
256(4x64) K bytes
SA56-SA59
1110XXXXX
256(4x64) K bytes
SA60-SA62
111100XXX
111101XXX
111110XXX
192(3x64) K bytes
SA63
111111000
8 K bytes
SA64
111111001
8 K bytes
SA65
111111010
8 K bytes
SA66
111111011
8 K bytes
SA67
111111100
8 K bytes
SA68
111111101
8 K bytes
SA69
111111110
8 K bytes
SA70
111111111
8 K bytes
相关PDF资料
PDF描述
WS-32K32-70HI 128K X 8 MULTI DEVICE SRAM MODULE, 70 ns, CPGA66
WS-32K32-100HI 128K X 8 MULTI DEVICE SRAM MODULE, 100 ns, CPGA66
WF512K32-90CJM 512K X 32 FLASH 5V PROM MODULE, 90 ns, CQCC68
WS512K32-100G4M 2M X 8 MULTI DEVICE SRAM MODULE, 100 ns, CQFP68
WS512K32-70G4M 2M X 8 MULTI DEVICE SRAM MODULE, 70 ns, CQFP68
相关代理商/技术参数
参数描述
W19B320B 制造商:WINBOND 制造商全称:Winbond 功能描述:32Mbit, 2.7~3.6-volt single bank CMOS flash memory
W19B320BB 制造商:WINBOND 制造商全称:Winbond 功能描述:32Mbit, 2.7~3.6-volt single bank CMOS flash memory
W19B320BB-H 制造商:WINBOND 制造商全称:Winbond 功能描述:2.7~3.6-volt write (program and erase) operations
W19B320BB-M 制造商:WINBOND 制造商全称:Winbond 功能描述:2.7~3.6-volt write (program and erase) operations
W19B320BT 制造商:WINBOND 制造商全称:Winbond 功能描述:32Mbit, 2.7~3.6-volt single bank CMOS flash memory