参数资料
型号: W24LH8S-70SL
厂商: WINBOND ELECTRONICS CORP
元件分类: SRAM
英文描述: 32K X 8 STANDARD SRAM, 70 ns, PDSO28
封装: 0.330 INCH, SOP-28
文件页数: 9/10页
文件大小: 186K
代理商: W24LH8S-70SL
Preliminary W24LH8
- 8 -
PACKAGE DIMENSIONS
28-pin P-DIP
Seating Plane
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and
are determined at the mold parting line.
6. General appearance spec. should be based on
final visual inspection spec.
1.63
1.47
0.064
0.058
Notes:
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
B
c
D
e
A
L
S
A
1
2
E
0.060
1.52
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.540
0.550
0.545
13.72
13.97
13.84
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
B 1
1
e
E 1
a
1.460
1.470
37.08
37.34
0
15
0.090
2.29
0.650
0.630
16.00
16.51
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
15
0
eA
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
28
1
15
14
28-pin SOP Wide Body
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimensions D & E include mold mismatch
and determined at the mold parting line.
.
0.25
0.20
0.010
0.008
Notes:
Symbol
Min. Nom.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
0.014
0.36
0.112
2.85
0.004
0.093
0.014
0.098
0.016
0.103
0.020
2.36
0.36
0.10
2.49
0.41
2.62
0.51
0.059
0.004
0
10
0.713
0.067
0.733
0.075
1.50
18.11
1.70
18.62
1.91
0.477
0.465
0.453
12.12
11.81
11.51
0
10
0.10
8.53
8.41
8.28
0.336
0.331
0.326
0.71
0.91
1.12
0.028
0.036
0.044
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
1.12
1.27
1.42
0.044
0.050
0.056
1.19
0.047
2
1
A
28
15
14
1
e
S
E
H
b
Seating Plane
A A
y
L
e
c
See Detail F
D
E
1
e
Detail F
A
b
c
D
e
H E
L
y
A
L E
1
2
E
S
θ
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