参数资料
型号: W25Q32BVSSAG
厂商: WINBOND ELECTRONICS CORP
元件分类: PROM
英文描述: 32M X 1 SPI BUS SERIAL EEPROM, PDSO8
封装: 0.208 INCH, GREEN, SOIC-8
文件页数: 56/79页
文件大小: 1090K
代理商: W25Q32BVSSAG
W25Q32BV
- 6 -
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q32BV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pad WSON 6x5-mm or 8x6-mm
(package code ZP & ZE), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package
code SF) and a 24-ball 8x6-mm TFBGA (package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1 Pin Configuration SOIC 208-mil
1
2
3
4
8
7
6
5
/CS
DO (IO
1)
/WP (IO
2)
GND
VCC
/HOLD (IO
DI (IO
0)
CLK
Top View
3)
Figure 1a. W25Q32BV Pin Assignments, 8-pin SOIC 208-mil (Package Code SS)
3.2 Pad Configuration WSON 6x5-mm / 8X6-mm
1
2
3
4
/CS
DO (IO
1)
/WP (IO
2)
GND
VCC
/HOLD (IO
3)
DI (IO
0)
CLK
Top View
8
7
6
5
Figure 1b. W25Q32BV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP & ZE)
相关PDF资料
PDF描述
W25Q32BVSSAP 32M X 1 SPI BUS SERIAL EEPROM, PDSO8
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相关代理商/技术参数
参数描述
W25Q32BVSSAP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVSSIG 功能描述:IC SPI FLASH 32MBIT 8SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.173",4.40mm 宽) 供应商设备封装:8-MFP 包装:带卷 (TR)
W25Q32BVSSIG TR 制造商:Winbond Electronics Corp 功能描述:SPIFLASH, 32M-BIT, 4KB UNIFORM
W25Q32BVSSIP 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
W25Q32BVTCAG 制造商:WINBOND 制造商全称:Winbond 功能描述:3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI