参数资料
型号: W25Q64CVSSIG
厂商: Winbond Electronics
文件页数: 6/80页
文件大小: 0K
描述: IC SPI FLASH 64MBIT 8-SOIC
标准包装: 90
系列: SpiFlash®
格式 - 存储器: 闪存
存储器类型: FLASH
存储容量: 64M(8M x 8)
速度: 80MHz
接口: SPI 串行
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIC
包装: 管件
其它名称: Q5822008
W25Q64CV
3. PACKAGE TYPES AND PIN CONFIGURATIONS
W25Q64CV is offered in an 8-pin SOIC 208-mil (package code SS), an 8-pad WSON 6x5-mm or 8x6-mm
(package code ZP & ZE), an 8-pin PDIP 300-mil (package code DA), a 16-pin SOIC 300-mil (package
code SF) and a 24-ball 8x6-mm TFBGA (package code TC) as shown in Figure 1a-e respectively.
Package diagrams and dimensions are illustrated at the end of this datasheet.
3.1
Pin Configuration SOIC / VSOP 208-mil
Top View
/CS
DO (IO 1 )
/WP (IO 2 )
GND
1
2
3
4
8
7
6
5
VCC
/HOLD (IO 3 )
CLK
DI (IO 0 )
Figure 1a. W25Q64CV Pin Assignments, 8-pin SOIC / VSOP 208-mil (Package Code SS / ST)
3.2
Pad Configuration WSON 6x5-mm / 8X6-mm
Top View
/CS
DO (IO 1 )
/WP (IO 2 )
GND
1
2
3
4
8
7
6
5
VCC
/HOLD (IO 3 )
CLK
DI (IO 0 )
Figure 1b. W25Q64CV Pad Assignments, 8-pad WSON 6x5-mm / 8x6-mm (Package Code ZP / ZE)
-6-
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