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参数资料
| 型号： | W25Q80BWZPIP |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | PROM |
| 英文描述： | 8M X 1 SPI BUS SERIAL EEPROM, PDSO8 |
| 封装： | 6 X 5 MM, GREEN , PLASTIC, WSON-8 |
| 文件页数： | 66/71页 |
| 文件大小： | 0K |
| 代理商： | W25Q80BWZPIP |
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W25Q80BW
Publication Release Date: January 26, 2011
- 69 -
Preliminary - Revision A
11. ORDERING INFORMATION
W(1) 25Q 80B W xx(2)
W = Winbond
25Q = SpiFlash Serial Flash Memory with 4KB sectors, Dual/Quad I/O
80B = 8M-bit
W = 1.65V to 1.95V
SN = 8-pin SOIC 150-mil
SS = 8-pin SOIC 208-mi
ZP
= 8-pad WSON 6x5-mm
UX = 8-pad USON 2x3-mm
I = Industrial (-40°C to +85°C)
G = Green Package (Lead-free, RoHS Compliant, Halogen-free (TBBA), Antimony-Oxide-free Sb2O3)
P
= Green Package with Status Register Power-Down & OTP enabled
(3,4)
Notes:
1. The “W” prefix is not included on the part marking.
2. Only the 2
nd letter is used for the part marking.
WSON package type ZP is not used for the part marking.
USON package type UX has special top marking due to size limitation.
3. Standard bulk shipments are in Tube (shape E). Please specify alternate packing method, such as Tape and
Reel (shape T) or Tray (shape S), when placing orders.
4. For shipments with OTP feature enabled, please specify when placing orders.
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