参数资料
| 型号： | W25X20CLSNIG |
| 厂商： | Winbond Electronics |
| 文件页数： | 2/2页 |
| 文件大小： | 0K |
| 描述： | IC FLASH SPI 2MBIT 8SOIC |
| 标准包装： | 100 |
| 系列： | SpiFlash® |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 2M (256K x 8) |
| 速度： | 50MHz |
| 接口： | SPI 串行 |
| 电源电压： | 2.3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
Density
Winbond Part # 2
Quad Clock
SPI MHz
Features 3
Voltage
Package 4
Sample
Availability
512M-bit
W25M512JVxIG/Q
W25Q256FVxIG/Q/F
?
?
104
80/104
QPI, Enhanced, DTR
QPI, Enhanced
3V
3V
x=(F,E,C 6 ,B 6 )
x=(F,E,C 6 ,B 6 )
Q4-2014
Now
256M-bit
W25Q257FVxIG/Q
5
?
80/104
QPI, Enhanced
3V
x=(F,E)
Q1-2014
W25Q256JVxIG/Q
W25Q128FVxIG/Q/F
?
?
80/104
104
QPI, Enhanced, DTR
QPI, Enhanced
3V
3V
x=(F,E,C 6 ,B 6 )
x=(S,T 6 ,F,P,E,C 6 ,B 6 )
Q4-2014
Now
x=(S,T ,F ,P )
xx=(SS,ST ,SF ,ZP )
xx=(SS,ST ,SF,ZP,ZE,TC ,TB )
xx=(SN,SV ,SS,ST ,SF ,ZP,TC ,TB ,UU,BY )
xx=(SN,SV,ZP,UX )
128M-bit
64M-bit
32M-bit
16M-bit
8M-bit
4M-bit
2M-bit
1M-bit
512K-bit
W25R128FVxIQ
W25Q128JVxIG/Q
W25Q128FWxIG
W25Q64FVxxIG/Q/F
W25R64FVxxIQ
W25Q64JVxxIG/Q
W25Q64FWxxIG
W25Q32FVxxIG/Q/F
W25Q32JVxxIG/Q
W25Q32DWxxIG
W25Q32FWxxIG
W25Q16DVxxIG/Q
W25Q16CLxxIG
W25Q16DWxxIG
W25Q16FWxxIG
W25Q80BVxxIG
W25Q80DVxxIG
W25Q80BLxxIG
W25Q80DLxxIG
W25Q80BWxxIG 7
W25Q80EWxxIG
W25X40CLxxIG
W25Q40CLxxIG
W25Q40BWxxIG
W25Q40EWxxIG
W25X20CLxxIG
W25Q20CLxxIG
W25Q20BWxxIG
W25Q20EWxxIG
W25X10CLxxIG
W25Q10EWxxIG
W25X05CLxxIG
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
?
104
104
104
104
104
104
104
104
104
104
104
80/104
50/80
104
104
80/104
80/104
50/80
80/104
80
80
80/104
104
80
80
80/104
80/104
80
80
80/104
80/104
80/104
RPMC, Enhanced
QPI, Enhanced, DTR
QPI, Enhanced
QPI, Enhanced
RPMC, Enhanced
QPI, Enhanced, DTR
QPI, Enhanced
QPI, Enhanced
QPI, Enhanced, DTR
QPI, Enhanced
QPI, Enhanced
Enhanced
Enhanced
QPI, Enhanced
QPI, Enhanced
Fast Write, Enhanced
Fast Write, Enhanced
Fast Write, Enhanced
Fast Write, Enhanced
Fast Write, Enhanced
Fast Write, Enhanced
Fast Write
Fast Write, Enhanced
Fast Write, Enhanced
Fast Write, Enhanced
Fast Write
Fast Write
Fast Write, Enhanced
Fast Write, Enhanced
Fast Write
Fast Write, Enhanced
Fast Write
3V
3V
1.8V
3V
3V
3V
1.8V
3V
3V
1.8V
1.8V
3V
2.5V/3V
1.8V
1.8V
3V
3V
2.5V
2.5V
1.8V
1.8V
2.5V/3V
2.5V/3V
1.8V
1.8V
2.5V/3V
2.5V/3V
1.8V
1.8V
2.5V/3V
1.8V
2.5V/3V
6 6 6
x=(S,T 6 ,F,P,E,C 6 ,B 6 )
x=(S,T 6 ,F 6 ,P)
xx=(SS,ST 6 ,SF,ZP,ZE,TC,TB 6 )
6 6 6
xx=(SS,ST 6 ,SF,ZP,ZE,TC,TB 6 )
xx=(SS,ST 6 ,SF 6 ,ZP,BY)
6 6 6
xx=(SS,ST 6 ,SF,ZP,ZE,TC 6 ,TB 6 )
xx=(SS,ST 6 ,SF 6 ,ZP,ZE 6 )
xx=(SS,ST 6 ,SF 6 ,ZP,ZE 6 ,XG)
xx=(SN,SV 6 ,SS,ST 6 ,ZP,TC 6 ,TB 6 )
xx=(SN,SV 6 ,SS,ZP)
xx=(SN,SV 6 ,SS,ST 6 ,SF 6 ,ZP,TC 6 ,TB 6 ,UU,BY 6 )
6 6 6 6 6 6
xx=(SN,SS,ZP,UX)
xx=(SN,SV,SS,ZP,UX)
xx=(SN,SV,SS,ZP,UX)
xx=(SN,SV,SS,ZP,UX)
xx=(SN,SV,SS,ZP,UU 6 ,BY 6 )
xx=(SN,SV,SS,ZP,UU 6 ,BY 6 )
xx=(SN,SV,SS,ZP,UX)
xx=(SN,SS,UX 6 )
xx=(SN,SV,SS 6 ,ZP,UX,UU 6 )
xx=(SN,SV,SS 6 ,ZP,UX,UU 6 )
xx=(SN,SV,ZP,UX)
xx=(SN,SV,ZP,UX)
xx=(SN,SV,ZP,UX 6 )
6
xx=(SN,SV 6 ,ZP 6 ,UX)
xx=(SN,SV 6 ,ZP 6 ,UX)
xx=(SN,SD 6 ,UX)
Now
Q4-2014
Now
Now
Now
Q3-2014
Now
Now
Q3-2014
Now
Q1-2014
Now
Now
Now
Q3-2014
Use W25Q80DV
Now
Now
Q2-2014
Now
Q4-2014
Now
Now
Now
Q4-2014
Now
Now
Now
Q2-2014
Now
Q2-2014
Now
1. See data sheet for further technical information. This is subject to change without notice.
2. At the end of the part number, letter “G” represents "Green", Halogen Free and
RoHS compliant packaging; letter “Q” represents Green packaging and Quad Enabled as shipping default & fast sector erase time (tSE); letter “F” represents Fast Sector Erase time
(tSE); letter “I” represents Industrial Temperature (-40 ° C to +85 ° C).
Non-Volatile & Volatile Status Registers, Complement Array Protection.
3. Enhanced=SFDP 1 , Security Registers, Program/Erase Suspend/Resume, Burst Read with Wrap,
4. SN=SO8 150mil, SV=VSOP8 150mil, SS or S=SO8 208mil, ST or T=VSOP8 208mil, SF or F=SO16
300mil, SD=TSSOP8 173mil, ZP or P=WSON8 6x5mm, ZE or E=WSON8 8x6mm, TC or C=TFBGA24 8x6mm (4x6 Matrix), TB or B=TFBGA24 8X6mm (5X5 Matrix), UX=USON8
2x3mm, UU=USON8 4x3mm, XG=XSON8 4x4m, BY=WLBGA. KGD Wafer available.
for Suspend/Resume feature support on W25Q80BW.
5. Default 4-byte addressing for W25W257FV. 6. Special Order.
7. Contact Winbond
Winbond Electronics Corporation (Headquarters)
No. 8, Keya Rd. I, Central Taiwan Science Park
Taichung County, 428, Taiwan, R.O.C.
Tel: 886-4-25218168
www.winbond.com
Winbond Electronics Corporation America
2727 North First Street, San Jose, CA 95134 USA
Tel: 1-408-943-6666 Fax: 1-408-544-1798
January 2014 REV 3.0
相关PDF资料 |
PDF描述 |
|---|---|
| AMM28DTBH | CONN EDGECARD 56POS R/A .156 SLD |
| AMM28DTBD | CONN EDGECARD 56POS R/A .156 SLD |
| AMM28DTAN | CONN EDGECARD 56POS R/A .156 SLD |
| XC2V3000-5BF957C | IC FPGA VIRTEX II 3M 957-FCBGA |
| AMM28DTAH | CONN EDGECARD 56POS R/A .156 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W25X20CLSNIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 2MBIT 50MHZ 8SOIC |
| W25X20CLUXIG | 制造商:Winbond Electronics Corp 功能描述: |
| W25X20CLZPIG | 功能描述:IC FLASH SPI 2MBIT 8WSON RoHS:是 类别:集成电路 (IC) >> 存储器 系列:SpiFlash® 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W25X20CLZPIG TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 2MBIT 50MHZ 8WSON |
| W25X20L | 制造商:WINBOND 制造商全称:Winbond 功能描述:1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI |
发布紧急采购，3分钟左右您将得到回复。