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参数资料
| 型号： | W27C02P-70 |
| 英文描述： | EEPROM|256KX8|CMOS|LDCC|32PIN|PLASTIC |
| 中文描述： | EEPROM的| 256KX8 |的CMOS | LDCC | 32脚|塑料 |
| 文件页数： | 13/15页 |
| 文件大小： | 184K |
| 代理商： | W27C02P-70 |
W27C01
Publication Release Date: April 15, 2002
- 13 -
Revision A2
PACKAGE DIMENSIONS
32-pin P-DIP
Seating Plane
e
A
2
A
a
c
E
Base Plane
1
A
1
e
L
A
S
1
E
D
1
B
B
32
1
16
17
1. Dimensions D Max. & S include mold flash or
2. Dimension E1 does not include interlead flash.
3. Dimensions D & E1 include mold mismatch and
4. Dimension B1 does not include dambar
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
Notes:
1.37
1.22
0.054
0.048
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
A
A
B
B
1
c
D
E
E
1
e
L
a
A
S
1
2
0.050
1.27
0.210
5.33
0.010
0.150
0.016
0.155
0.018
0.160
0.022
3.81
0.41
0.25
3.94
0.46
4.06
0.56
0.008
0.120
0.670
0.010
0.130
0.014
0.140
0.20
3.05
0.25
3.30
0.36
3.56
0.540
0.555
0.550
13.84
14.10
13.97
17.02
15.24
14.99
15.49
0.600
0.590
0.610
2.29
2.54
2.79
0.090
0.100
0.110
1
e
1.650
1.660
41.91
42.16
0
15
0.085
2.16
0.650
0.630
16.00
16.51
15
0
32-lead PLCC
L
c
1
b
2
A
H
E
E
e
b
D
H
D
y
A
A
1
Seating Plane
E
G
G
D
1
13
14
20
29
32
4
5
21
30
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based on nal
visual inspection sepc.
θ
Symbol
Min. Nom. Max.
Max.
Nom.
Min.
Dimension in Inches
Dimension in mm
A
A
A
b
1
b
c
D
E
e
G
D
G
E
H
E
L
y
1
2
3.56
0.50
H
D
0.020
0.140
2.80
2.67
2.93
0.71
0.66
0.81
0.41
0.46
0.56
0.20
0.25
0.35
13.89
13.97
14.05
11.35
11.43
11.51
1.27
12.45
12.95
13.46
0.530
0.510
0.490
0.050
0.453
0.450
0.447
0.553
0.550
0.547
0.014
0.010
0.008
0.022
0.018
0.016
0.032
0.026
0.028
0.115
0.105
0.110
1.12
1.42
0.044
0.056
0
°
10
°
10
°
0
°
9.91
10.41
10.92
14.86
14.99
15.11
12.32
12.45
12.57
1.91
2.29
0.004
0.095
0.090
0.075
0.495
0.490
0.485
0.595
0.590
0.585
0.430
0.410
0.390
0.10
2.41
θ
相关PDF资料 |
PDF描述 |
|---|---|
| W27C02Q-70 | EEPROM|256KX8|CMOS|TSSOP|32PIN|PLASTIC |
| W27C01 | EPROM |
| W27E01 | FPGA Fusion® Family 250K Gates Commercial 130nm (CMOS) Technology 1.5V 256-Pin FBGA |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W27C02Q-70 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:EEPROM|256KX8|CMOS|TSSOP|32PIN|PLASTIC |
| W27C20-70 | 制造商:WINBOND 制造商全称:Winbond 功能描述:256K X 8 ELECTRICALLY ERASABLE EPROM |
| W27C4096 | 制造商:WINBOND 制造商全称:Winbond 功能描述:256K X 16 ELECTRICALLY ERASABLE EPROM |
| W27C4096-12 | 制造商:WINBOND 制造商全称:Winbond 功能描述:256K X 16 ELECTRICALLY ERASABLE EPROM |
| W27C4096-15 | 制造商:WINBOND 制造商全称:Winbond 功能描述:256K X 16 ELECTRICALLY ERASABLE EPROM |
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