参数资料
| 型号： | W29GL128CH9T |
| 厂商： | Winbond Electronics |
| 文件页数： | 3/67页 |
| 文件大小： | 0K |
| 描述： | IC FLASH 128MBIT 90NS 56TSOP |
| 标准包装： | 96 |
| 格式 - 存储器： | 闪存 |
| 存储器类型： | FLASH |
| 存储容量： | 128M（16M x 8，8M x 16） |
| 速度： | 90ns |
| 接口： | 并联 |
| 电源电压： | 2.7 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 56-TFSOP（0.724"，18.40mm 宽） |
| 供应商设备封装： | 56-TSOP |
| 包装： | 管件 |
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W29GL128C
Table of Contents
1
2
3
4
5
6
GENERAL DESCRIPTION ......................................................................................................... 1
FEATURES ................................................................................................................................. 1
PIN CONFIGURATION ............................................................................................................... 2
BLOCK DIAGRAM ...................................................................................................................... 3
PIN DESCRIPTION ..................................................................................................................... 3
ARRAY ARCHITECTURE........................................................................................................... 4
6.1
Sector Address Table ..................................................................................................... 4
7
FUNCTIONAL DESCRIPTION.................................................................................................... 5
7.1
7.2
Device Bus Operation ..................................................................................................... 5
Instruction Definitions...................................................................................................... 6
7.2.1
7.2.2
7.2.3
7.2.4
7.2.5
7.2.6
7.2.7
7.2.8
7.2.9
7.2.10
7.2.11
7.2.12
7.2.13
7.2.14
7.2.15
7.2.16
7.2.17
7.2.18
7.2.19
7.2.20
7.2.21
7.2.22
7.2.23
Reading Array Data .......................................................................................................... 6
Page Mode Read .............................................................................................................. 6
Device Reset Operation .................................................................................................... 7
Standby Mode ................................................................................................................... 7
Output Disable Mode ........................................................................................................ 7
Write Operation ................................................................................................................. 7
Byte/Word Selection ......................................................................................................... 8
Automatic Programming of the Memory Array .................................................................. 8
Erasing the Memory Array ................................................................................................ 9
Erase Suspend/Resume ............................................................................................... 10
Sector Erase Resume ................................................................................................... 10
Program Suspend/Resume ........................................................................................... 11
Program Resume .......................................................................................................... 11
Write Buffer Programming Operation ............................................................................ 11
Buffer Write Abort ......................................................................................................... 12
Accelerated Programming Operation ............................................................................ 12
Automatic Select Bus Operation ................................................................................... 12
Automatic Select Operations......................................................................................... 13
Automatic Select Instruction Sequence ........................................................................ 13
Enhanced Variable IO (EVIO) Control .......................................................................... 14
Hardware Data Protection Options ............................................................................... 14
Inherent Data Protection ............................................................................................... 14
Power Supply Decoupling ............................................................................................. 14
7.3
Enhanced Sector Protect/Un-protect ............................................................................ 15
7.3.1
7.3.2
Lock Register .................................................................................................................. 16
Individual (Non-Volatile) Protection Mode ....................................................................... 17
7.4
Security Sector Flash Memory Region ......................................................................... 20
7.4.1
7.4.2
Factory Locked: Security Sector Programmed and Protected at factory......................... 20
Customer Lockable: Security Sector Not Programmed or Protected .............................. 20
7.5
7.6
Instruction Definition Tables ......................................................................................... 21
Common Flash Memory Interface (CFI) Mode ............................................................. 25
7.6.1
Query Instruction and Common Flash memory Interface (CFI) Mode ............................. 25
8
ELECTRICAL CHARACTERISTICS ......................................................................................... 29
Publication Release Date: August 2, 2013
i
Revision H
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相关代理商/技术参数 |
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| W29GL128CH9T TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 128MBIT 90NS 56TSOP |
| W29GL128CL9B | 功能描述:IC FLASH 128MBIT 90NS 64LFBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1 系列:- 格式 - 存储器:闪存 存储器类型:闪存 - NAND 存储容量:4G（256M x 16） 速度:- 接口:并联 电源电压:2.7 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:48-TFSOP（0.724"，18.40mm 宽） 供应商设备封装:48-TSOP I 包装:Digi-Reel® 其它名称:557-1461-6 |
| W29GL128CL9B TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 128MBIT 90NS 64LFBGA |
| W29GL128CL9T | 功能描述:IC FLASH 128MBIT 90NS 56TSOP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:2,500 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:1K (128 x 8) 速度:100kHz 接口:UNI/O?（单线） 电源电压:1.8 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-TSSOP，8-MSOP（0.118"，3.00mm 宽） 供应商设备封装:8-MSOP 包装:带卷 (TR) |
| W29GL128CL9T TR | 制造商:Winbond Electronics Corp 功能描述:IC FLASH 128MBIT 90NS 56TSOP |
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