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参数资料
| 型号： | W2Z1M72SJ35BC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 1M X 72 MULTI DEVICE SRAM MODULE, 3.5 ns, PBGA209 |
| 封装： | PLASTIC, BGA-209 |
| 文件页数： | 1/12页 |
| 文件大小： | 624K |
| 代理商： | W2Z1M72SJ35BC |
1
White Electronic Designs Corporation (508) 366-5151
www.whiteedc.com
W2Z1M72SJ
DESCRIPTION
The WEDC SyncBurst - SRAM family employs high-
speed, low-power CMOS designs that are fabricated us-
ing an advanced CMOS process. WEDCs 72Mb
SyncBurst SRAMs integrate two 1Mx36 SRAMs into a
single BGA package to provide a 1Mx72 configuration.
All synchronous inputs pass through registers controlled
by a positive-edge-triggered single-clock input (CLK).
The NBL or No Bus Latency Memory utilizes all the band-
width in any combination of operating cycles. Address,
data inputs, and all control signals except output enable
and linear burst order are synchronized to input clock.
Burst order control must be tied High or Low. Asyn-
chronous inputs include the sleep mode enable (ZZ) and
Output Enable (OE). Write cycles are internally self-timed
and initiated by the rising edge of the clock input. This
feature eliminates complex off-chip write pulse genera-
tion and provides increased timing flexibility for incom-
ing signals.
72Mb, 1Mx72 Synchronous Pipeline Burst NBL SRAM
FIG. 1 PIN CONFIGURATION
BLOCK DIAGRAM
(TOP VIEW)
Address Bus
(A0-A19)
D0 - D35
D36 - D71
DQ0 - DQ71
1M x 36
CLK
CKE
ADV
LBO
CS1
CS2
OE
WE
BWA
BWB
BWC
BWD
ZZ
CLK
CKE
ADV
LBO
CS1
CS2
OE
WE
BWE
BWF
BWG
BWH
ZZ
CLK
CKE
ADV
LBO
CS1
CS2
OE
WE
ZZ
BWA
BWB
BWC
BWD
BWA
BWB
BWC
BWD
FEATURES
n Fast clock speed: 225, 200, 166 and 150MHz
n Fast access times: 2.8, 3.0, 3.5 and 3.8ns
n Fast OE access times: 2.8, 3.0, 3.5 and 3.8ns
n Separate Core and I/O Power Supply
n Snooze Mode for reduced-standby power
n Individual Byte Write control
n Clock-controlled and registered addresses,
data I/Os and control signals
n Burst control (interleaved or linear burst)
n Packaging:
209-bump BGA package, JEDEC Pin Definition
n Low capacitive bus loading
Preliminary*
* This data sheet describes a product that may not be fully qualified or
characterized and is subject to change without notice.
12
3
4
5
6
7
8
9
10
11
A DQG
DQG
ACS2
A
ADV
A
CS2
ADQB DQB
B DQG
DQG BWC BWG
NC
WE
A
BWB BWF DQB DQB
C DQG
DQG BWH BWD
NC CS1
NC BWE BWA DQB DQB
D DQG
DQG
VSS
NC
OE
NC
VSS DQB DQB
E DQPG DQPC VDDQ VDDQ VDD VDD
VDD VDDQ VDDQ DQPF DQPB
F DQC
DQC
VSS
NC
VSS VSS
VSS DQF DQF
G DQC
DQC VDDQ VDDQ VDD NC
VDD VDDQ VDDQ DQF DQF
H DQC
DQC
VSS
NC
VSS VSS
VSS DQF DQF
J
DQC
DQC VDDQ VDDQ VDD NC
VDD VDDQ VDDQ DQF DQF
K
NC
CLK
NC
VSS CKE
VSS
NC
L DQH
DQH VDDQ VDDQ VDD NC
VDD VDDQ VDDQ DQA DQA
M DQH
DQH
VSS
NC
VSS VSS
VSS DQA DQA
N DQH
DQH VDDQ VDDQ VDD NC
VDD VDDQ VDDQ DQA DQA
P DQH
DQH
VSS
ZZ
VSS VSS
VSS DQA DQA
R DQPD DQPH VDDQ VDDQ VDD VDD
VDD VDDQ VDDQ DQPA DQPE
T DQD
DQD
VSS
NC
NC LBO
NC
VSS DQE DQE
U DQD
DQD
NC
A
A19
AA
A
NC DQE DQE
V DQD
DQD
AA
A
A1
AA
A
DQE DQE
W DQD
DQD RFU RFU
A
A0
A
RFU RFU DQE DQE
January 2003 Rev. 1
ECO #15889
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