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参数资料
| 型号： | W3E16M72S-266BI |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 16M X 72 DDR DRAM, 0.75 ns, PBGA219 |
| 封装： | 32 X 25 MM, PLASTIC, BGA-219 |
| 文件页数： | 8/17页 |
| 文件大小： | 766K |
| 代理商： | W3E16M72S-266BI |
16
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3E16M72S-XBX
February 2005
Rev. 7
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 16M x 72
2.5V Power Supply
DATA RATE (MHz)
200 = 200Mbps
250 = 250Mbps
266 = 266Mbps
PACKAGE:
B = 219 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W
3E 16M 72 S - XXX B X
相关PDF资料 |
PDF描述 |
|---|---|
| W3E16M72S-200BI | 16M X 72 DDR DRAM, 0.8 ns, PBGA219 |
| W3E16M72SR-200BM | 16M X 72 DDR DRAM, 0.75 ns, PBGA219 |
| W3E16M72SR-200BC | 16M X 72 DDR DRAM, 0.75 ns, PBGA219 |
| W3E16M72SR-200BM | 16M X 72 DDR DRAM, 0.75 ns, PBGA219 |
| W3EG2128M72AFSR262AD3M | 256M X 72 DDR DRAM MODULE, 0.75 ns, DMA184 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E16M72S-266BM | 制造商:Microsemi Corporation 功能描述:16M X 72 DDR, 2.5V, 266 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E16M72S-333BC | 制造商:Microsemi Corporation 功能描述:16M X 72 DDR, 2.5V, 333 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E16M72S-333BI | 制造商:Microsemi Corporation 功能描述:16M X 72 DDR, 2.5V, 333 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E16M72S-333BM | 制造商:Microsemi Corporation 功能描述:16M X 72 DDR, 2.5V, 333 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E16M72SR-200BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:16Mx72 Registered DDR SDRAM |
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