参数资料
型号: W3E32M64S-200BM
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: 32M X 64 DDR DRAM, 0.8 ns, PBGA219
封装: 25 X 25 MM, PLASTIC, BGA-219
文件页数: 7/17页
文件大小: 847K
代理商: W3E32M64S-200BM
W3E32M64S-XBX
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
February 2007
Rev. 4
50. ICC2N species the DQ, DQS, and DM to be driven to a valid high or low logic level.
ICC2Q is similar to ICC2F except ICC2Q species the address and control inputs to
remain stable. Although ICC2F, ICC2N, and ICC2Q are similar, ICC2F is “worst case.”
51. Whenever the operating frequency is altered, not including jitter, the DLL is required
to be reset. This is followed by 200 clock cycles before any READ command.
52. This is the DC voltage supplied at the DRAM and is inclusive of all noise up to 20
MHz. Any noise above 20 MHz at the DRAM generated from any source other than
that of the DRAM itself may not exceed the DC voltage range of 2.6V ± 100mV.
相关PDF资料
PDF描述
W3E32M64S-250BM 32M X 64 DDR DRAM, 0.8 ns, PBGA219
W3E32M64S-266BI 32M X 64 DDR DRAM, 0.75 ns, PBGA219
W3E32M64S-250SBI 32M X 64 DDR DRAM, 0.8 ns, PBGA208
W3E32M64S-400SBC 32M X 64 DDR DRAM, 0.7 ns, PBGA208
W3E32M64SA-200BC 32M X 64 DDR DRAM, 0.8 ns, PBGA219
相关代理商/技术参数
参数描述
W3E32M64S-200SBC 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk
W3E32M64S-200SBI 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 208 PBGA, INDUSTRIAL TEMP. - Bulk
W3E32M64S-200SBM 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 208 PBGA, MIL-TEMP. - Bulk
W3E32M64S-250BC 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk
W3E32M64S-250BI 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk