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参数资料
| 型号： | W3E32M64S-200SBI |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | DRAM |
| 英文描述： | 32M X 64 DDR DRAM, 0.8 ns, PBGA208 |
| 封装： | 13 X 22 MM, PLASTIC, BGA-208 |
| 文件页数： | 10/18页 |
| 文件大小： | 648K |
| 代理商： | W3E32M64S-200SBI |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W3E32M64S-XSBX
January 2008
Rev. 6
Document Title
32M x 64 DDR SDRAM Multi-Chip Package
Revision History
Rev #
History
Release Date
Status
Rev 6
Changes (Pg. 1, 7, 15, 17)
6.1 Update package thickness to match Mechanical Outline
6.2 Add CAS Latency of 3 to Figure 3
January 2008
Final
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PDF描述 |
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| WF128K32A-120HSI | 512K X 8 FLASH 12V PROM MODULE, 120 ns, CHIP66 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E32M64S-200SBM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 200 MHZ, 208 PBGA, MIL-TEMP. - Bulk |
| W3E32M64S-250BC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, COMMERCIAL TEMP. - Bulk |
| W3E32M64S-250BI | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk |
| W3E32M64S-250BM | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E32M64S-250SBC | 制造商:Microsemi Corporation 功能描述:32M X 64 DDR, 2.5V, 250 MHZ, 208 PBGA, COMMERCIAL TEMP. - Bulk |
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