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参数资料
| 型号： | W3E64M72S-266SBC |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | DRAM |
| 英文描述： | 64M X 72 DDR DRAM, 0.75 ns, PBGA219 |
| 封装： | 25 X 32 MM, PLASTIC, BGA-219 |
| 文件页数： | 10/19页 |
| 文件大小： | 496K |
| 代理商： | W3E64M72S-266SBC |
W3E64M72S-XSBX
18
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
September 2007
Rev. 3
White Electronic Designs Corp. reserves the right to change products or specications without notice.
ORDERING INFORMATION
WHITE ELECTRONIC DESIGNS CORP.
DDR SDRAM
CONFIGURATION, 64M x 72
2.5V Power Supply
DATA RATE (Mbs)
200 = 200Mbs
250 = 250Mbs
266 = 266Mbs
333 = 333Mbs
PACKAGE:
SB = 219 Plastic Ball Grid Array (PBGA)
DEVICE GRADE:
M = Military
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial 0°C to +70°C
W 3E 64M 72 S - XXX SB X
相关PDF资料 |
PDF描述 |
|---|---|
| W3E64M72S-333SBI | 64M X 72 DDR DRAM, 0.7 ns, PBGA219 |
| W3E64M72S-333SBM | 64M X 72 DDR DRAM, 0.7 ns, PBGA219 |
| W3E64M72S-200SBC | 64M X 72 DDR DRAM, 0.8 ns, PBGA219 |
| W3E64M72S-333SBC | 64M X 72 DDR DRAM, 0.7 ns, PBGA219 |
| W3E64M72S-266SBM | 64M X 72 DDR DRAM, 0.75 ns, PBGA219 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| W3E64M72S-266SBI | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR, 2.5V, 266 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk 制造商:White Electronic Designs 功能描述:64M X 72 DDR, 2.5V, 266 MHZ, 219 PBGA, INDUSTRIAL TEMP. - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY |
| W3E64M72S-266SBM | 制造商:Microsemi Corporation 功能描述:64M X 72 DDR, 2.5V, 266 MHZ, 219 PBGA, MIL-TEMP. - Bulk |
| W3E64M72S-333BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx72 DDR SDRAM |
| W3E64M72S-333BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx72 DDR SDRAM |
| W3E64M72S-333BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx72 DDR SDRAM |
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