参数资料
型号: W3E64M72S-333BI
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: DRAM
英文描述: 64M X 72 SYNCHRONOUS DRAM, 0.7 ns, PBGA219
封装: 25 X 32 MM, PLASTIC, BGA-219
文件页数: 9/19页
文件大小: 674K
代理商: W3E64M72S-333BI
W3E64M72S-XBX
17
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
June 2005
Rev. 0
ADVANCED
White Electronic Designs Corp. reserves the right to change products or specications without notice.
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
BOTTOM VIEW
PACKAGE DIMENSION: 219 PLASTIC BALL GRID ARRAY (PBGA)
32.1 (1.264) MAX
1 2 3 4 5 6 7 8 9 10 11121314 1516
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
25.1 (0.988)
MAX
19.05 (0.750)
NOM
1.27 (0.050)
NOM
19.05 (0.750) NOM
2.96 (0.116)
MAX
0.61
(0.024)
NOM
219 x 0.762 (0.030) NOM
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相关代理商/技术参数
参数描述
W3E64M72S-333BM 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx72 DDR SDRAM
W3E64M72S-333ESC 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx72 DDR SDRAM
W3E64M72S-333ESI 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:64Mx72 DDR SDRAM
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W3E64M72S-333SBI 制造商:Microsemi Corporation 功能描述:W3E64M72S-333SBI - Bulk 制造商:Microsemi Corporation 功能描述:SDRAM MEMORY