参数资料
型号: W3EG264M64EFSU335D4-M
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: DRAM
英文描述: 128M X 64 DDR DRAM MODULE, 0.7 ns, DMA200
封装: SO-DIMM-200
文件页数: 8/11页
文件大小: 190K
代理商: W3EG264M64EFSU335D4-M
W3EG264M64EFSU-D4
6
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
August 2005
Rev. 0
ADVANCED
DDR SDRAM COMPONENT ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC
OPERATING CONDITIONS
0°C ≤ TA ≤ +70°C; VCC = VCCQ = +2.5V ±0.2V
AC CHARACTERISTICS
403
335
262
265
UNITS NOTES
PARAMETER
SYMBOL
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
Access window of DQs from CK/CK#
tAC
-0.65
+0.65
-0.70
+0.70
-0.75
+0.75
-0.75
0.75
ns
CK high-level width
tCH
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
26
CK low-level width
tCL
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
26
Clock cycle time
CL = 3
tCK (3)
5
10
ns
39, 44
CL = 2.5
tCK (2.5)
6
13
7.5
13
7.5
13
ns
39, 44
CL = 2
tCK (2)
7.5
13
7.5
13
7.5/10
13
ns
39, 44
DQ and DM input hold time relative to DQS
tDH
0.40
0.45
0.5
ns
23, 27
DQ and DM input setup time relative to DQS
tDS
0.40
0.45
0.5
ns
23, 27
DQ and DM input pulse width (for each input)
tDIPW
1.75
ns
27
Access window of DQS from CK/CK#
tDQSCK
-0.55
+0.55
-0.60
+0.60
-0.75
+0.75
-0.75
+0.75
ns
DQS input high pulse width
tDQSH
0.35
tCK
DQS input low pulse width
tDQSL
0.35
tCK
DQS-DQ skew, DQS to last DQ valid, per group, per
access
tDQSQ
0.4
0.5
ns
22, 23
Write command to rst DQS latching transition
tDQSS
0.72
1.25
0.75
1.25
0.75
1.25
0.75
1.25
tCK
DQS falling edge to CK rising - setup time
tDSS
0.20
0.2
tCK
DQS falling edge from CK rising - hold time
tDSH
0.20
0.2
tCK
Half clock period
tHP
tCH,tCL
tCH, tCL
ns
30
Data-out high-impedance window from CK/CK#
tHZ
+0.65
+0.70
+0.75
ns
16, 36
Data-out low-impedance window from CK/CK#
tLZ
-0.65
+0.65
-0.70
-0.75
ns
16, 36
Address and control input hold time (fast slew rate)
tIHF
0.60
0.75
0.90
ns
12
Address and control input setup time (fast slew rate)
tISF
0.60
0.75
0.90
ns
12
Address and control input hold time (slow slew rate)
tIHS
0.8
1
ns
12
相关PDF资料
PDF描述
W3EG7266S335AD4I 64M X 72 DDR DRAM MODULE, 0.7 ns, DMA200
W3HG64M72EEU665PD4GG 64M X 72 DDR DRAM MODULE, 0.45 ns, DMA200
W7NCF02GH21CS2BG 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF02GH21CS2EG 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF02GH21CS2HG 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
相关代理商/技术参数
参数描述
W3EG264M64EFSU335D4-X 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1GB - 2x64Mx64 DDR SDRAM, UNBUFFERED, FBGA
W3EG264M64EFSU403D4-X 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1GB - 2x64Mx64 DDR SDRAM, UNBUFFERED, FBGA
W3EG264M64EFSU-D4 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1GB - 2x64Mx64 DDR SDRAM, UNBUFFERED, FBGA
W3EG264M64EFSUXXXD4-MG 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1GB - 2x64Mx64 DDR SDRAM, UNBUFFERED, FBGA
W3EG264M64EFSUXXXD4-SG 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1GB - 2x64Mx64 DDR SDRAM, UNBUFFERED, FBGA