参数资料
型号: W3EG6418S202JD3
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: DRAM
英文描述: 16M X 64 DDR DRAM MODULE, 0.75 ns, DMA184
封装: DIMM-184
文件页数: 10/12页
文件大小: 0K
代理商: W3EG6418S202JD3
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W3EG6418S-D3
-JD3
May 2005
Rev. 3
PRELIMINARY
White Electronic Designs Corp. reserves the right to change products or specications without notice.
DDR SDRAM COMPONENT ELECTRICAL CHARACTERISTICS AND
RECOMMENDED AC OPERATING CONDITIONS
AC Characteristics
262
263/265
202
Parameter
Symbol
Min
Max
Min
Max
Min
Max
Units
Notes
Access window of DQs from CK, CK#
tAC
-0.75
+0.75
-0.75
+0.75
-0.75
+0.75
ns
CK high-level width
tCH
0.45
0.55
0.45
0.55
0.45
0.55
tCK
16
CK low-level width
tCL
0.45
0.55
0.45
0.55
0.45
0.55
tCK
16
Clock cycle time
CL=2.5
tCK (2.5)
7.5
13
7.5
13
7.5
13
ns
22
CL=2
tCK (2)
7.5
13
7.5
13
10
13
ns
22
DQ and DM input hold time relative to DQS
tDH
0.5
ns
14,17
DQ and DM input setup time relative to DQS
tDS
0.5
ns
14,17
DQ and DM input pulse width (for each input)
tDIPW
1.75
ns
17
Access window of DQS from CK, CK#
tDQSCK
-0.75
+0.75
-0.75
+0.75
-0.75
+0.75
ns
DQS input high pulse width
tDQSH
0.35
tCK
DQS input low pulse width
tDQSL
0.35
tCK
DQS-DQ skew, DQS to last DQ valid, per group,
per access
tDQSQ
0.5
ns
13,14
Write command to rst DQS latching transition
tDQSS
0.75
1.25
0.75
1.25
0.75
1.25
tCK
DQS falling edge to CK rising - setup time
tDSS
0.2
tCK
DQS falling edge from CK rising - hold time
tDSH
0.2
tCK
Half clock period
tHP
tCH, tCL
ns
18
Data-out high-impedance window from CK, CK#
tHZ
+0.75
ns
8,19
Data-out low-impedance window from CK, CK#
tLZ
-0.75
ns
8,20
Address and control input hold time (fast slew rate)
tIHf
0.90
ns
6
Address and control input set-up time (fast slew rate)
tISf
0.90
ns
6
Address and control input hold time (slow slew rate)
tIHs
111
ns
6
Address and control input setup time (slow slew rate)
tISs
111
ns
6
Address and control input pulse width (for each input)
tIPW
2.2
ns
LOAD MODE REGISTER command cycle time
tMRD
15
ns
DQ-DQS hold, DQS to rst DQ to go non-valid, per access
tQH
tHP-tQHS
tHP-
tQHS
ns
13,14
Data hold skew factor
tQHS
0.75
ns
ACTIVE to PRECHARGE command
tRAS
40
120,000
40
120,000
40
120,000
ns
15
ACTIVE to READ with Auto precharge command
tRAP
15
20
ns
ACTIVE to ACTIVE/AUTO REFRESH command period
tRC
60
65
ns
AUTO REFRESH command period
tRFC
75
ns
21
相关PDF资料
PDF描述
W3EG72256S263JD3SG 256M X 72 DDR DRAM MODULE, 0.75 ns, DMA184
W3HG2128M64EEU403XD4IMG 256M X 64 DDR DRAM MODULE, 0.6 ns, ZMA200
W7MG21M32SVB90BNI 2M X 32 FLASH 3.3V PROM MODULE, 90 ns, SMA80
W7NCF02GH30IS4HG 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
W7NCF02GH30IS7HG 128M X 16 FLASH 3.3V PROM CARD, 150 ns, UUC
相关代理商/技术参数
参数描述
W3EG6418S-D3 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:128MB - 16Mx64 DDR SDRAM UNBUFFERED
W3EG6418S-JD3 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:128MB - 16Mx64 DDR SDRAM UNBUFFERED
W3EG64255MS100JD3GG 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1GB-128Mx72 DDR SDRAM REGISTERED ECC w/PLL
W3EG64255MS100JD3MG 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1GB-128Mx72 DDR SDRAM REGISTERED ECC w/PLL
W3EG64255MS100JD3SG 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1GB-128Mx72 DDR SDRAM REGISTERED ECC w/PLL