参数资料
型号: W3EG6462S202JD3
厂商: MICROSEMI CORP-PMG MICROELECTRONICS
元件分类: DRAM
英文描述: 64M X 64 DDR DRAM MODULE, 0.75 ns, DMA184
封装: DIMM-184
文件页数: 11/13页
文件大小: 254K
代理商: W3EG6462S202JD3
White Electronic Designs
W3EG6462S-D3
-JD3
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
May 2005
Rev. 4
ADVANCED
DDR SDRAM COMPONENT ELECTRICAL CHARACTERISTICS AND
RECOMMENDED AC OPERATING CONDITIONS
AC CHARACTERISTICS
403
335
262
263/265
202
PARAMETER
SYMBOL MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX
MIN
MAX UNITS NOTES
Access window of DQs from CK/CK#
tAC
-0.7
+0.7 -0.75 +0.75 -0.75 +0.75 -0.75 +0.75
ns
CK high-level width
tCH
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
26
CK low-level width
tCL
0.45
0.55
0.45
0.55
0.45
0.55
0.45
0.55
tCK
26
Clock cycle time
CL = 3
tCK (3)
5
7.5
6
13
7.5
13
7.5
13
7.5
13
ns
40, 45
CL = 2.5
tCK (2.5)
6
13
6
13
7.5
13
7.5
13
7.5
13
ns
40, 45
CL = 2
tCK (2)
7.5
13
7.5
13
7.5/10
13
7.5/10
13
7.5/10
13
ns
40, 45
DQ and DM input hold time relative to DQS
tDH
0.4
0.45
0.5
ns
23, 27
DQ and DM input setup time relative to DQS
tDS
0.4
0.45
0.5
ns
23, 27
DQ and DM input pulse width (for each input)
tDIPW
1.75
ns
27
Access window of DQS from CK/CK#
tDQSCK
-0.6
-0.60 +0.60 -0.75 +0.75 -0.75 +0.75 -0.75 +0.75
ns
DQS input high pulse width
tDQSH
0.35
tCK
DQS input low pulse width
tDQSL
0.35
tCK
DQS-DQ skew, DQS to last DQ valid, per group, per
access
tDQSQ
0.40
0.45
0.5
ns
22, 23
Write command to rst DQS latching transition
tDQSS
0.72
1.28
0.75
1.25
0.75
1.25
0.75
1.25
0.75
1.25
tCK
DQS falling edge to CK rising - setup time
tDSS
0.2
tCK
DQS falling edge from CK rising - hold time
tDSH
0.2
tCK
Half clock period
tHP
tCH,tCL
ns
31
Data-out high-impedance window from CK/CK#
tHZ
+0.70
+0.75
ns
16, 36
Data-out low-impedance window from CK/CK#
tLZ
-0.70
-0.75
ns
16, 36
Address and control input hold time (fast slew rate)
tIHF
0.6
0.75
0.90
.90
ns
12
Address and control input setup time (fast slew rate)
tISF
0.6
0.75
0.90
.90
ns
12
Address and control input hold time (slow slew rate)
tIHS
0.6
0.80
1
ns
12
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