参数资料
型号: W3EG6462S263D3
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: DRAM
英文描述: 64M X 64 DDR DRAM MODULE, 0.75 ns, DMA184
封装: DIMM-184
文件页数: 10/13页
文件大小: 254K
代理商: W3EG6462S263D3
White Electronic Designs
W3EG6462S-D3
-JD3
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
May 2005
Rev. 4
ADVANCED
IDD1 : OPERATING CURRENT : ONE BANK
1.
Typical Case : VCC=2.5V, T=25°C
2.
Worst Case : VCC=2.7V, T=10°C
3.
Only one bank is accessed with tRC (min), Burst
Mode, Address and Control inputs on NOP edge
are changing once per clock cycle. IOUT = 0mA
4.
Timing Patterns :
DDR200 (100 MHz, CL=2) : tCK=10ns, CL2,
BL=4, tRCD=2*tCK, tRAS=5*tCK
Read : A0 N R0 N N P0 N A0 N - repeat the
same timing with random address changing;
50% of data changing at every burst
DDR266 (133MHz, CL=2.5) : tCK=7.5ns,
CL=2.5, BL=4, tRCD=3*tCK, tRC=9*tCK, tRAS=5*tCK
Read : A0 N N R0 N P0 N N N A0 N - repeat
the same timing with random address
changing; 50% of data changing at every burst
DDR266 (133MHz, CL=2) : tCK=7.5ns, CL=2,
BL=4, tRCD=3*tCK, tRC=9*tCK, tRAS=5*tCK
Read : A0 N N R0 N P0 N N N A0 N - repeat
the same timing with random address
changing; 50% of data changing at every burst
DDR333 (166MHz, CL=2.5) : tCK=6ns, BL=4,
tRCD=10*tCK, tRAS=7*tCK
Read : A0 N N R0 N P0 N N N A0 N - repeat
the same timing with random address
changing; 50% of data changing at every burst
DDR400 (200MHz, CL=3) : tCK=5ns, BL=4,
tRCD=15*tCK, tRAS=7*tCK
Read : A0 N N R0 N P0 N N N A0 N - repeat
the same timing with random address
changing; 50% of data changing at every burst
IDD7A : OPERATING CURRENT : FOUR BANKS
1.
Typical Case : VCC=2.5V, T=25°C
2.
Worst Case : VCC=2.7V, T=10°C
3.
Four banks are being interleaved with tRC (min),
Burst Mode, Address and Control inputs on NOP
edge are not changing. Iout=0mA
4.
Timing Patterns :
DDR200 (100 MHz, CL=2) : tCK=10ns, CL2,
BL=4, tRRD=2*tCK, tRCD=3*tCK, Read with
Autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 A0 R3 A1 R0
- repeat the same timing with random address
changing; 100% of data changing at every
burst
DDR266 (133MHz, CL=2.5) : tCK=7.5ns,
CL=2.5, BL=4, tRRD=3*tCK, tRCD=3*tCK
Read with Autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N
A1 R0 - repeat the same timing with random
address changing; 100% of data changing at
every burst
DDR266 (133MHz, CL=2) : tCK=7.5ns, CL2=2,
BL=4, tRRD=2*tCK, tRCD=2*tCK
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N
A1 R0 - repeat the same timing with random
address changing; 100% of data changing at
every burst
DDR333 (166MHz, CL=2.5) : tCK=6ns,
BL=4, tRRD=3*tCK, tRCD=3*tCK, Read with
Autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N
A1 R0 - repeat the same timing with random
address changing; 100% of data changing at
every burst
DDR400 (200MHz, CL=3) : tCK=5ns,
BL=4, tRRD=10*tCK, tRCD=15*tCK, Read with
Autoprecharge
Read : A0 N A1 R0 A2 R1 A3 R2 N R3 A0 N
A1 R0 - repeat the same timing with random
address changing; 100% of data changing at
every burst
DETAILED TEST CONDITIONS FOR DDR SDRAM IDD1 & IDD7A
Legend:
A = Activate, R = Read, W = Write, P = Precharge, N = NOP
A (0-3) = Activate Bank 0-3
R (0-3) = Read Bank 0-3
相关PDF资料
PDF描述
W332M64V-100SBC 32M X 64 SYNCHRONOUS DRAM, 7 ns, PBGA208
W986416EH-7 4M X 16 SYNCHRONOUS DRAM, 5.5 ns, PDSO54
WS128K32-20HSI 512K X 8 MULTI DEVICE SRAM MODULE, 20 ns, CHIP66
WS512K32N-100H2M 2M X 8 MULTI DEVICE SRAM MODULE, 100 ns, HIP66
WMF128K8-70DEC5A 128K X 8 FLASH 5V PROM, 70 ns, CDSO32
相关代理商/技术参数
参数描述
W3EG6462S263JD3 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 2x32Mx64 DDR SDRAM UNBUFFERED
W3EG6462S265D3 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 2x32Mx64 DDR SDRAM UNBUFFERED
W3EG6462S265JD3 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 2x32Mx64 DDR SDRAM UNBUFFERED
W3EG6462S335D3 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 2x32Mx64 DDR SDRAM UNBUFFERED
W3EG6462S335JD3 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 2x32Mx64 DDR SDRAM UNBUFFERED