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参数资料
| 型号： | W3EG7262S265D3S |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | DRAM |
| 英文描述： | 64M X 72 DDR DRAM MODULE, 0.75 ns, DMA184 |
| 封装： | DIMM-184 |
| 文件页数： | 10/12页 |
| 文件大小： | 218K |
| 代理商： | W3EG7262S265D3S |
W3EG7262S-D3
-JD3
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
May 2005
Rev. 3
PRELIMINARY
DDR SDRAM COMPONENT ELECTRICAL CHARACTERISTICS AND
RECOMMENDED AC OPERATING CONDITIONS
0°C ≤ TA ≤ +70°C; VCC = +2.5V ± 0.2V, VCCQ = +2.5V ± 0.2V
AC Characteristics
262
265, 202
Parameter
Symbol
Min
Max
Min
Max
Units
Notes
Access window of DQs from CK, CK#
tAC
-0.75
+0.75
-0.75
+0.75
ns
CK high-level width
tCH
0.45
0.55
0.45
0.55
tCK
16
CK low-level width
tCL
0.45
0.55
0.45
0.55
tCK
16
Clock cycle time
CL=2.5
tCK (2.5)
7.5
13
7.5
13
ns
22
CL=2
tCK (2)
7.5
13
10
13
ns
22
DQ and DM input hold time relative to DQS
tDH
0.5
ns
14,17
DQ and DM input setup time relative to DQS
tDS
0.5
ns
14,17
DQ and DM input pulse width (for each input)
tDIPW
1.75
ns
17
Access window of DQS from CK, CK#
tDQSCK
-0.75
+0.75
-0.75
+0.75
ns
DQS input high pulse width
tDQSH
0.35
tCK
DQS input low pulse width
tDQSL
0.35
tCK
DQS-DQ skew, DQS to last DQ valid, per group,
per access
tDQSQ
0.5
ns
13,14
Write command to rst DQS latching transition
tDQSS
0.75
1.25
0.75
1.25
tCK
DQS falling edge to CK rising - setup time
tDSS
0.2
tCK
DQS falling edge from CK rising - hold time
tDSH
0.2
tCK
Half clock period
tHP
tCH, tCL
ns
18
Data-out high-impedance window from CK, CK#
tHZ
+0.75
ns
8,19
Data-out low-impedance window from CK, CK#
tLZ
-0.75
ns
8,20
Address and control input hold time (fast slew rate)
tIHf
0.90
ns
6
Address and control input set-up time (fast slew rate)
tISf
0.90
ns
6
Address and control input hold time (slow slew rate)
tIHs
1
ns
6
Address and control input setup time (slow slew rate)
tISs
1
ns
6
Address and control input pulse width (for each input)
tIPW
2.2
ns
LOAD MODE REGISTER command cycle time
tMRD
15
ns
DQ-DQS hold, DQS to rst DQ to go non-valid, per access
tQH
tHP-tQHS
ns
13,14
Data hold skew factor
tQHS
0.75
ns
ACTIVE to PRECHARGE command
tRAS
45
120,000
45
120,000
ns
15
ACTIVE to READ with Auto precharge command
tRAP
20
ns
ACTIVE to ACTIVE/AUTO REFRESH command period
tRC
65
ns
AUTO REFRESH command period
tRFC
75
ns
21
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W3EG7262S265JD3 | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 2X32Mx72 DDR SDRAM UNBUFFERED |
| W3EG7262S-D3 | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 2X32Mx72 DDR SDRAM UNBUFFERED |
| W3EG7262S-JD3 | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 2X32Mx72 DDR SDRAM UNBUFFERED |
| W3EG7263S202AJD3 | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB- 64Mx72 DDR SDRAM REGISTERED w/PLL |
| W3EG7263S202D3 | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB- 64Mx72 DDR SDRAM REGISTERED w/PLL |
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