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参数资料
| 型号： | W4L14Z104MAT1S |
| 厂商： | AVX Corporation |
| 文件页数： | 1/4页 |
| 文件大小： | 0K |
| 描述： | CAP CER 0.1UF 4V 20% X7S 0306 |
| 标准包装： | 1 |
| 系列： | IDC |
| 电容： | 0.1µF |
| 电压 - 额定： | 4V |
| 容差： | ±20% |
| 温度系数： | X7S |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 旁通，去耦 |
| 封装/外壳： | 非标准型 SMD |
| 尺寸/尺寸： | 0.063" L x 0.032" W（1.60mm x 0.82mm） |
| 厚度（最大）： | 0.022"（0.55mm） |
| 特点： | 低 ESL 型（多端子） |
| 包装： | 标准包装 |
| 其它名称： | 478-6615-6 |
IDC Low Inductance Capacitors (RoHS)
0306/0612/0508 IDC (InterDigitated Capacitors)
GENERAL DESCRIPTION
Inter-Digitated Capacitors (IDCs) are used for both semiconductor
package and board level decoupling. The equivalent series
inductance (ESL) of a single capacitor or an array of capacitors in
parallel determines the response time of a Power Delivery Network
0612
(PDN). The lower the ESL of a PDN, the faster the response time.
+
–
+
–
A designer can use many standard MLCCs in parallel to reduce
ESL or a low ESL Inter-Digitated Capacitor (IDC) device. These IDC
devices are available in versions with a maximum height of 0.95mm
or 0.55mm.
IDCs are typically used on packages of semiconductor products
with power levels of 15 watts or greater. Inter-Digitated Capacitors
are used on CPU, GPU, ASIC, and ASSP devices produced on
0.13μ, 90nm, 65nm, and 45nm processes. IDC devices are used
on both ceramic and organic package substrates. These low ESL
surface mount capacitors can be placed on the bottom side or the
top side of a package substrate. The low profile 0.55mm maximum
height IDCs can easily be used on the bottom side of BGA
packages or on the die side of packages under a heat spreader.
IDCs are used for board level decoupling of systems with speeds of
0508
0306
TYPICAL IMPEDANCE
10
300MHz or greater. Low ESL IDCs free up valuable board space by
reducing the number of capacitors required versus standard
MLCCs. There are additional benefits to reducing the number of
capacitors beyond saving board space including higher reliability
from a reduction in the number of components and lower
placement costs based on the need for fewer capacitors.
1
0.1
0.01
MLCC_1206
LICC_0612
IDC_0612
The Inter-Digitated Capacitor (IDC) technology was developed by
AVX. This is the second family of Low Inductance MLCC products
0.001
1
10
100
1000
created by AVX. IDCs are a cost effective alternative to AVX’s first
Frequency (MHz)
generation low ESL family for high-reliability applications known as
LICA (Low Inductance Chip Array).
AVX IDC products are available with a lead-free finish of plated
Nickel/Tin.
LEAD-FREE COMPATIBLE
HOW TO ORDER
COMPONENT
W
3
L
1
6
D
225
M
A
T
3
A
Style
IDC
Low
Number
Voltage
Dielectric Capacitance Capacitance Failure
Termination Packaging
Thickness
Z = X7S
Case
Size
2 = 0508
3 = 0612
4 = 0306
Inductance
of 4 = 4V
Terminals 6 = 6.3V
1 = 8 Terminals Z = 10V
Y = 16V
3 = 25V
C = X7R Code (In pF)
D = X5R 2 Sig. Digits +
Number of
Zeros
Tolerance Rate
M = ±20% A = N/A
T = Plated Ni
and Sn
Available
1=7" Reel
3=13" Reel
Max. Thickness
mm (in.)
A=Standard
S=0.55 (0.022)
NOTE: Contact factory for availability of Termination and Tolerance Options for Specific Part Numbers.
PERFORMANCE CHARACTERISTICS
Capacitance Tolerance
±20% Preferred
Dielectric Strength
No problems observed after 2.5 x RVDC
Operation
Temperature Range
Temperature Coefficient
X7R = -55°C to +125°C
X5R = -55°C to +85°C
X7S = -55°C to +125°C
±15% (0VDC), ±22% (X7S)
for 5 seconds at 50mA max current
CTE (ppm/C) 12.0
Thermal Conductivity 4-5W/M K
Voltage Ratings
Dissipation Factor
4, 6.3, 10, 16, 25 VDC
≤ 6.3V = 6.5% max;
Terminations
Available
Plated Nickel and Solder
10V = 5.0% max;
≥ 16V = 3.5% max
Insulation Resistance
(@+25°C, RVDC)
72
100,000MΩ min, or 1,000MΩ per
μF min.,whichever is less
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| W4L14Z224MAT1S | 功能描述:电容器阵列与网络 0306 .22uF 4v X7S 20% RoHS:否 制造商:AVX 电容:0.1 uF 容差:20 % 电压额定值:6.3 V 元件数量:2 工作温度范围: 外壳长度:0.8 mm 外壳宽度:1.6 mm 外壳高度:0.5 mm 端接类型:SMD/SMT 系列:PG |
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