参数资料
型号: W671561Y
厂商: WINBOND ELECTRONICS CORP
元件分类: 模拟传输电路
英文描述: TELECOM-SLIC, QCC32
封装: 7 X 7 MM, 0.65 MM PITCH, QFN-32
文件页数: 35/42页
文件大小: 1230K
代理商: W671561Y
W671500 SERIES
12.2.1. Special Considerations for the QFN Package
The QFN package offers a significant footprint reduction (65%) and improved thermal performance
with respect to the 28 lead PLCC. To realize the thermal enhancements and maintain the high voltage
(-100V) performance the exposed leadframe should be soldered to a power/heat sink plane that is
electrically connected to the high battery supply (VBH) within the application board. This approach
distributes the heat evenly across the board and is accomplished by using conductive thermal
- 40 -
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