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参数资料
| 型号： | W72M64VB100BI |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA159 |
| 封装： | 13 X 22 MM, PLASTIC, BGA-159 |
| 文件页数： | 15/16页 |
| 文件大小： | 660K |
| 代理商： | W72M64VB100BI |
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W72M64VB-XBX
June 2009
Rev. 2
FIGURE 6: PROGRAM OPERATIONS
Addresses
CS#
OE#
WE#
Data
RY/BY#
VCC
555h
PA
tWC
tAH
tWHWH1
PD
Status
DOUT
A0h
tBUSY
PA
tAS
tCH
tWP
tCS
tWPH
tDS
tDH
tVCS
tRB
NOTES:
1.
PA is the address of the memory location to be programmed.
2.
PD is the data to be programmed at byte address.
3.
DOUT is the output of the data written to the device.
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相关代理商/技术参数 |
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| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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