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参数资料
| 型号： | W72M64VB70BM |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA159 |
| 封装： | 13 X 22 MM, PLASTIC, BGA-159 |
| 文件页数： | 7/16页 |
| 文件大小： | 668K |
| 代理商： | W72M64VB70BM |
15
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
W72M64VB-XBX
September 2008
Rev. 0
ADVANCED
PACKAGE: 159 PBGA
WHITE ELECTRONIC DESIGNS CORP.:
Flash:
Organization, 2M x 64:
User Congurable as 2 x 2M x 32
3.3V Power Supply:
Internal Bank Architecture:
B = Bottom boot block
Access Time (ns):
70 = 70ns
90 = 90ns
100 = 100ns
120 = 120ns
Package Type:
B = 159 Plastic BGA, 13mm x 22mm
Device Grade:
M = Military Screened
-55°C to +125°C
I = Industrial
-40°C to +85°C
C = Commercial
0°C to +70°C
W 7 2M64 V B XXX B X
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相关代理商/技术参数 |
参数描述 |
|---|---|
| W72M64VB-90BI | 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VB-90BM | 制造商:White Electronic Designs 功能描述:Flash Module Parallel 128Mbit 制造商:Microsemi Corporation 功能描述:72 X 64 SRAM MODULE, - Bulk |
| W72M64VK100BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
| W72M64VK100BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package |
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