参数资料
型号: W72M64VK100BI
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: PROM
英文描述: 2M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159
封装: 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159
文件页数: 1/16页
文件大小: 555K
代理商: W72M64VK100BI
1
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
W72M64VK-XBX
April 2005
Rev. 0
2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
Access Times of 90, 100, 120ns
Packaging
159 PBGA, 13x22mm - 1.27mm pitch
1,000,000 Erase/Program Cycles
Sector Architecture
Bank 1 (4Mb): eight 4K word, eight 32K word
Bank 2 (12Mb): twenty-four 32K word
Bank 3 (12Mb): twenty-four 32K word
Bank 4 (4Mb): eight 32K word
Bottom boot block
Zero Power Operation
Organized as 2Mx64 or 2x2Mx32
Commercial, Industrial and Military Temperature
Ranges
3.3 Volt for Read and Write Operations
Simultaneous Read/Write Operation:
Data can be continuously read from one bank
while executing erase/program functions in
another bank
Zero latency between read and write operations
Erase Suspend/Resume
Suspends erase operations to allow programming
in same bank
Data# Polling and Toggle Bits
Provides a software method of detecting the
status of program or erase cycles
Unlock Bypass Program command
Reduces overall programming time when issuing
multiple program command sequences
Ready/Busy# output (RY/BY#)
Hardware method for detecting program or erase
cycle completion
Hardware reset pin (RESET#)
Hardware method of resetting the internal state
machine to the read mode
WP#/ACC input pin
Write protect (WP#) function allows protection
two outermost boot sectors, regardless of sector
protect status
Acceleration (ACC) function accelerates program
timing
Sector Protection
Hardware method of locking a sector, either
in-system or using programming equipment, to
prevent any program or erase operation within
that sector
Temporary Sector Unprotect allows changing
data in protected sectors in-system
Note: For programming information refer to Flash Programming
W72M64V-XBX Application Note.
This product is subject to change without notice.
FEATURES
相关PDF资料
PDF描述
W78M64110SBM 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159
W78M64110SBI 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159
W78M64120SBI 8M X 64 FLASH 3.3V PROM, 120 ns, PBGA159
W78M64110SBC 8M X 64 FLASH 3.3V PROM, 110 ns, PBGA159
W78M64V100SBC 8M X 64 FLASH 3.3V PROM MODULE, 100 ns, PBGA159
相关代理商/技术参数
参数描述
W72M64VK100BM 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
W72M64VK120BC 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
W72M64VK120BI 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
W72M64VK120BM 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
W72M64VK90BC 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package