参数资料
型号: W963B6BBN80I
厂商: WINBOND ELECTRONICS CORP
元件分类: SRAM
英文描述: 512K X 16 PSEUDO STATIC RAM, 75 ns, PBGA48
封装: 6 X 8 MM, 0.75 MM PITCH, TFBGA-48
文件页数: 23/29页
文件大小: 948K
代理商: W963B6BBN80I
W963B6BBN
1. GENERAL DESCRIPTION
W963B6BBN is a 8M bits CMOS pseudo static random access memory (Pseudo SRAM), organized
as 512K words x 16 bits. Using advanced single transistor DRAM architecture and 0.175
m process
technology; W963B6BBN delivers fast access cycle time and low power consumption. It is suitable for
mobile device application such as Cellular Phone and PDA, which high-density buffer is needed and
power dissipation is most concerned.
2. FEATURES
Asynchronous SRAM interface
Fast access cycle time:
tRC = 70 nS (-70), 80 nS (-80)
Low power consumption:
IDDA1 = 20 mA Max.
IDDS1 = 70 A Max.
Byte write control
Power supply:
VDD = +2.3V to +2.7V
Temperature:
TA = 0°C to +70°C
TA = -25°C to +85°C (Extended temperature)
TA = -40°C to +85°C (Industrial temperature)
3. PRODUCT OPTIONS
PARAMETER
W963B6BBN70
W963B6BBN80
tRC
70 nS min.
80 nS Min.
IDDS1
70
A max.
70
A Max.
IDDA1
20 mA
VDD
2.3V to 2.7V
Publication Release Date: March 11, 2003
- 3 -
Revision A1
相关PDF资料
PDF描述
WED3DG6332V10D2 32M X 64 SYNCHRONOUS DRAM MODULE, DMA168
WF512K32-60G4M5A 512K X 32 FLASH 5V PROM MODULE, 60 ns, CQFP68
WS128K32L-17G1UQA 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68
WS128K32L-20G1UQ 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68
WS128K32L-25G1TCA 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68
相关代理商/技术参数
参数描述
W963L6ABN 制造商:WINBOND 制造商全称:Winbond 功能描述:512K WORD X 16 BIT LOW POWER PSEUDO SRAM
W963L6ABN70 制造商:WINBOND 制造商全称:Winbond 功能描述:512K WORD X 16 BIT LOW POWER PSEUDO SRAM
W963L6ABN70E 制造商:WINBOND 制造商全称:Winbond 功能描述:512K WORD X 16 BIT LOW POWER PSEUDO SRAM
W963L6ABN70I 制造商:WINBOND 制造商全称:Winbond 功能描述:512K WORD X 16 BIT LOW POWER PSEUDO SRAM
W963L6ABN80 制造商:WINBOND 制造商全称:Winbond 功能描述:512K WORD X 16 BIT LOW POWER PSEUDO SRAM