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参数资料
| 型号： | WEDPS512K32-35BC |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PBGA143 |
| 封装： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件页数： | 5/6页 |
| 文件大小： | 202K |
| 代理商： | WEDPS512K32-35BC |
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WEDPS512K32-XBX
PACKAGE 756: 143 BALL GRID ARRAY
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.61 (0.024)
BSC
1.27
(0.050)
BSC
A
B
C
D
E
F
G
H
J
K
L
M
13.97 (0.550)
BSC
16.25 (0.640)
MAX
18.25 (0.719)
MAX
13.97 (0.550)
BSC
2.21 (0.087)
MAX
BOTTOM VIEW
12 11 10 9
8
7
6
5 4
3
2
1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WEDPS512K32LV-12BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-12BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-15BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-15BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
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