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参数资料
| 型号： | WEDPS512K32LV-17BC |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, PBGA143 |
| 封装： | 16 X 18 MM, PLASTIC, BGA-143 |
| 文件页数： | 5/7页 |
| 文件大小： | 268K |
| 代理商： | WEDPS512K32LV-17BC |
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WEDPS512K32V-XBX
June 2004
Rev. 5
PACKAGE 756: 143 BALL GRID ARRAY
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.61 (0.024)
BSC
1.27
(0.050)
BSC
1.27 (0.050) BSC
A
B
C
D
E
F
G
H
J
K
L
M
13.97 (0.550)
BSC
16.25 (0.640)
MAX
18.25 (0.719)
MAX
13.97 (0.550)
BSC
1.93 (0.076)
MAX
BOTTOM VIEW
12 11 10 9 8 7 6 5 4 3 2 1
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WEDPS512K32LV-17BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-17BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-20BC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-20BI | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
| WEDPS512K32LV-20BM | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512Kx32 SRAM 3.3V MULTI-CHIP PACKAGE |
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