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参数资料
| 型号： | WF1M32B-150HC3A |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3.3V PROM MODULE, 150 ns, CPGA66 |
| 封装： | 1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| 文件页数： | 11/13页 |
| 文件大小： | 481K |
| 代理商： | WF1M32B-150HC3A |
7
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
WF1M32B-XXX3
March 2006
Rev. 5
White Electronic Designs Corp. reserves the right to change products or specications without notice.
NOTES:
1. PA is the address of the memory location to be programmed.
2. PD is the data to be programmed at byte address.
3. D7# is the output of the complement of the data written to each chip.
4. DOUT is the output of the data written to the device.
5. Figure indicates last two bus cycles of four bus cycle sequence.
WRITE/ERASE/PROGRAM OPERATION, WE# CONTROLLED
s
e
s
er
d
A
CS#
E#
O
E#
W
at
a
D
V
0.
5
A
P
A
P
H
5
t
C
W
t
S
C
D
P
D#
7
D
T
U
O
t
H
A
t
H
P
W
t
H
D
t
S
D
Data#
Polling
t
S
A
t
C
R
t
P
W
H
0
A
0
A
t
E
O
t
F
D
t
H
O
t
E
C
t
L
W
H
G
t
1
H
W
H
W
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WF1M32B-150HI3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HI3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32B-150HM3 | 制造商:Microsemi Corporation 功能描述:1M X 32 FLASH MODULE, 3.3V, 150NS, BOOT BLOCK, 66 PGA 1.185" - Bulk |
| WF1M32B-150HM3A | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 3.3V Flash Module |
| WF1M32BP-100G2TI5A | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 Flash EEPROM Module |
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