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参数资料
| 型号： | WPATV002A |
| 元件分类： | 衰减器 |
| 英文描述： | 0 MHz - 2500 MHz RF/MICROWAVE FIXED ATTENUATOR |
| 封装： | CERAMIC PACKAGE-4 |
| 文件页数： | 7/9页 |
| 文件大小： | 274K |
| 代理商： | WPATV002A |
Drawn
WP
Checked
WP
App
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Page 7 of 9
Date
02/24/03
Revision No.
1.0
Drawing No.
WORLD PRODUCTS INC.
19654 Eighth St. East
P.O. Box 517
Sonoma, CA 95476
707-996-5201
707-996-3380
Table 4 Test procedures and requirements
IEC
60115-8
CLAUS
E
IEC
60068-2
TEST
METHO
D
TEST
PROCEDURE
REQUIREMENT
Test in accordance with the schedule of IEC publication 60115-8
4.4.1
visual
examination
no holes; clean surface;
no damage
attenuation
value
within the specified
tolerance of attenuation
value
VSWR
≤ 1.3
4.18
20(Tb)
resistance to
soldering
heat
unmounted chips immersed
in a solder bath at 260±5°C
for 10 s
no visible damage;
dB max.: ±0.1dB
4.13
short time
overload
room temperature,
P=6.25 x Pn;
5s (V ≤ 2 x Vmax)
dB max.: ±0.3dB
4.33
bending
Attenuators mounted on a
90mm glass-fabric based
epoxy resin PCB(FR4);
Bending: 3mm
no visible damage;
dB max.: ±0.3dB
4.19
14(Na)
rapid change
of
temperature
30 minutes at LCT and 30
minutes at UCT, 5 cycles
no visible damage;
dB max.: ±0.3dB
4.24.2
3(Ca)
damp heat
56 days;40±2°C,93+2/-
3%RH;
loaded with 0.01Pn
dB max.: ±0.3dB
4.25.1
endurance
70±2°C, 1000+48/-0 hours,
loaded with Pn or Vmax,1.5
hours on and 0.5 hours off
no visible damage;
dB max.: ±0.3dB
4.17
20(Ta)
solderability
unmounted chips completely
immersed in a solder bath at
235±5°C for 5±1 s
good tinning (≥95%
covered)
no visible damage
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