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参数资料
| 型号： | WPB-T603-121B |
| 元件分类： | 数据传输滤波器 |
| 英文描述： | 1 FUNCTIONS, 0.2 A, FERRITE CHIP |
| 封装： | EIA STD PACKAGE SIZE 0603 |
| 文件页数： | 30/36页 |
| 文件大小： | 1261K |
| 代理商： | WPB-T603-121B |
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WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380
www.worldproducts.com
110904 Rev. 11.0
35
CHIP FERRITE BEADS
Soldering Profile
REFLOW SOLDERING(Peak 230°C)
REFLOW SOLDERING (Peak 250°C)
FLOW SOLDERING
MANUAL SOLDERING
Precaution for Storage
Electrical characteristics of product will not change when stored under typical environmental conditions. However, it is possible that the
solderability of terminal electrodes and the characteristics of the tape packaging can change during storage. For this reason, the following
storage guidelines should be followed.
1.
Storage Environment: The tape packaging material is designed to withstand long-term storage but they will degrade more rapidly in
the presence of high temperature or high humidity. Therefore, product shall be stored in an ambient temperature of less than 40°C
with a relative humidity of less than 70%. The products should be used within 6 months of receipt. To achieve best solderability,
product should be used as soon as possible after unpacking. Leftover product must be stored in dry condition with desiccant.
2.
Corrosive gases: Since sulfur and chlorine may degrade the solderability of the terminal electrodes, it is important to store the product
in an environment free of such gases.
3.
Temperature fluctuations: Dew condensation may occur when the product is taken out of storage due to variation of temperature. It is
important to maintain a temperature-controlled environment.
300
200°C
230°C
150°C
0
50
100
150
200
250
60 sec. min.
20 sec. max.
Soldering
10 sec. max.
Cooling
60 sec. min.
250°C
220°C
190°C
150°C
0
50
100
150
200
250
300
350
100 sec. min.
60 sec. max.
Soldering
10 sec. max.
175°C
250°C
150°C
0
50
100
150
200
60 sec. min.
Dipping
10 sec. max.
Cooling
60 sec. min.
Preheating
100 sec. max.
T≤200°C/ .5 sec
300°C
Tc°C
soldering
2 sec max.
solder iron
30w max.
Diameter of
solder iron
1.2mm max.
T
180°C
相关PDF资料 |
PDF描述 |
|---|---|
| WPB-T603-121L | 1 FUNCTIONS, 0.2 A, FERRITE CHIP |
| WPB-T603-121T | 1 FUNCTIONS, 0.2 A, FERRITE CHIP |
| WPB-T603-241B | 1 FUNCTIONS, 0.2 A, FERRITE CHIP |
| WPB-T603-241L | 1 FUNCTIONS, 0.2 A, FERRITE CHIP |
| WPB-T603-241T | 1 FUNCTIONS, 0.2 A, FERRITE CHIP |
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