Page 5 of 7
Jan.-2002
RELIABILITY TEST
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Mechanical performance
Test item
Test condition / Test method
Specification
Solderability
Solder temp.
: 235
± 5°C
Immersion time: 2
± 1 sec
Solder: SN63
At least 80% of a surface of
each terminal electrode must
be covered by fresh solder.
Resistance to soldering heat
Solder: Sn63
Preheating temperature: 150
± 10°C
Solder Temperature: 260
± 5°C
Immersion time: 10
± 1 sec
Measurement to be made after keeping at room
temp. for 24
±2 hrs.
No mechanical damage.
Ceramic surface shall not be
exposed in the middle of the
termination or on the
terminated product edge by
leaching.
Drop Test
Height : 75 cm
Direction : 3 directions
Times : 3 times for each direction.
No mechanical damage.
Samples shall satisfy electrical
specification after test..
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Environmental characteristics
Test item
Test condition / Test method
Specification
Humidity (steady conditions)
Humidity:90% to 95% R.H.
Tempertaure:40
±2°C
Time: 500
±24 hours.
Measurement: After placing for 24 hours Minimum.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Temperature cycle
1.
30
±3 minutes at -40°C±3°C,
2.
10~15 minutes at room temperature,
3.
30
±3 minutes at +85°±3°C,
4.
10~15 minutes at room temperature,
Total 100 continuous cycles
Measurement after placing for 48
±2 hrs min.
No mechanical damage.
Samples shall satisfy
electrical specification after
test.
High temperature
Temperature: 85
°C±2°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
No mechanical damage.
Samples shall satisfy electrical
specification after test.
Low temperature
Temperature: -40
°C±3°C
Test duration: 24 hours
Measurement must be taken after subjection to the
above conditions, followed by exposure in room
environment for 1 to 2 hours.
No mechanical damage.
Samples shall satisfy electrical
specification after test.