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参数资料
| 型号： | WPC-1608-1.8SB |
| 元件分类： | 通用定值电感 |
| 英文描述： | 1 ELEMENT, 0.0018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封装： | CHIP, 1608, ROHS COMPLIANT |
| 文件页数： | 7/10页 |
| 文件大小： | 365K |
| 代理商： | WPC-1608-1.8SB |
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380
www.worldproducts.com
050505 Rev. 13.0
5
CHIP CERAMIC INDUCTORS
Reliability and Test Conditions
REQUIREMENTS
ITEM
1005
1608
2012
TEST CONDITION
Operating temp.range
-55°C~+125°C
-
Storage temp. & humidity range
40°C max. , 70% RH max.
at packing condition
Resistance to solder heat
1. No damage such as cracks should be caused in chip
element.
2. More than 75% of the terminal electrode shall be
covered with new solder.
3. Inductance change: ±within 5%
4. Quality factor change: ±within 30%
Preheat temperature: 100 to 150°C
Preheat time: 1min
Solder temperature: 260 ± 10°C
Dipping time: 10 ± 0.5sec.
Solderability
1. More than 90% of the terminal electrode shall be
covered with new solder.
2. Inductance change : ± within 5%
3. Quality factor change : ± within 30%
Preheat temperature: 100 to 150°C
Preheat time: 1min
Solder temperature: 230 ± 10°C
Dipping time: 3 ± 1sec.
Reflow soldering
1. More than 50% of the terminal electrode shall be
covered with new solder.
T
S
T * 0.5
Preheat temperature: 150°C
Preheat time: 1min
Solder temperature: 230°C
Soldering time: 10 sec. Max.
(Reflow soldering profile)
1. No mechanical damage.
Tensile strength
(Terminal strength)
Unit : Kgf(W)
W
-
1.0
2.0
W(kgf) min
W
1. No mechanical damage
Adhension of Terminal electrode
(Flexure strength)
Unit : mm (a,b,c), Kgf(W)
a
-
1.0
b
-
0.8
1.0
c
-
1.3
W
-
2.0
4.0
c
a
b
a
W
R 0.5
Land
1. The body shall not be damaged by forces applied (see
illustration.)
Body strength (Bending strength)
Unit : mm (d), Kgf(W)
d
-
1.3
W
-
2.0
3.0
d
R 0.5
1.0mm
W
T
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