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参数资料
| 型号： | WPM-0603-1.2SL |
| 元件分类： | 通用定值电感 |
| 英文描述： | 1 ELEMENT, 0.0012 uH, GENERAL PURPOSE INDUCTOR, SMD |
| 封装： | CHIP |
| 文件页数： | 5/9页 |
| 文件大小： | 423K |
| 代理商： | WPM-0603-1.2SL |
WORLD PRODUCTS INC. 19654 Eighth Street East, Sonoma, CA 95476, Phone (707) 996-5201, Fax (707) 996-3380
www.worldproducts.com
050605 Rev.9.0
4
MICRO INDUCTORS
Reliability and Test Conditions
ITEM
REQUIREMENTS
TEST CONDITION
Operating temp.
range
-55
°C~+125°C ≥
-
Storage temp. &
humidity range
-40
°C max. , 70% RH max.
at packing condition
Resistance to
solder heat
1.No damage such as cracks should be visible in chip element.
2.More than 75% of the terminal electrode shall be covered with new
solder.
3.Inductance change : ±within 5%
4.Quality factor change : ±within 30%
Preheat
temperature : 100 to 150
°C
Preheat time : 1min
Solder
temperature : 260 ±10
°C
Dipping time : 10 ±0.5sec.
Solderability
1.More than 90% of the terminal electrode shall be covered with new
solder.
2.Inductance change : ±within 5%
3.Quality factor change : ±within 30%
Preheat
temperature : 100 to 150
°C
Preheat time : 1min
Solder
temperature : 230 ±10
°C
Dipping time : 3 ±1sec.
Reflow soldering
1.More than 50% of the terminal electrode shall be covered with new
solder.
T
S
T * 0.5
Preheat
temperature : 150
°C
Preheat time : 1min
Solder
temperature : 230
°C
Soldering time : 10 sec.
max.
(Reflow soldering profile)
Bending Test
1.No mechanical damage.
R230
L20
45
0.8
1.5
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