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参数资料
| 型号： | WS128K32-35G2TIE |
| 元件分类： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| 封装： | 22.40 MM, CERAMIC, QFP-68 |
| 文件页数： | 6/6页 |
| 文件大小： | 0K |
| 代理商： | WS128K32-35G2TIE |
6
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS128K32-XG2TXE
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
E = Epitaxial Layer on die
DEVICE GRADE:
M = Military Screened -55
°C to +125°C
I = Industrial
-40
°C to +85°C
C = Commercial
0
°C to +70°C
PACKAGE TYPE:
G2T = 22.4mm Ceramic Quad Flat Pack, CQFP (Package 509)
ACCESS TIME (ns)
ORGANIZATION, 128Kx32
User configurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORPORATION
ORDERING INFORMATION
W S
128K 32 - XXX X X E X
* Low Power Data Retention only available in G2T Package Type
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PDF描述 |
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| WS128K32-45G2TIE | 128K X 32 MULTI DEVICE SRAM MODULE, 45 ns, CQFP68 |
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| WS512K32-70CJM | 512K X 8 MULTI DEVICE SRAM MODULE, 70 ns, CQCC68 |
| WV3HG232M64EEU665D4S | 64M X 64 DDR DRAM MODULE, 0.45 ns, DMA200 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WS128K32-35G2TM | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS128K32-35G2TQ | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS128K32-35G2UC | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 5V, 35NS, 68 CQFP 0.88" SQ., 0.140" H - Bulk |
| WS128K32-35G2UI | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 5V, 35NS, 68 CQFP 0.88" SQ., 0.140" H - Bulk |
| WS128K32-35G2UM | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 5V, 35NS, 68 CQFP 0.88" SQ., 0.140" H - Bulk |
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