参数资料
型号: WS128K32N-35H1M
厂商: WHITE ELECTRONIC DESIGNS CORP
元件分类: SRAM
英文描述: 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CPGA66
封装: 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
文件页数: 7/9页
文件大小: 546K
代理商: WS128K32N-35H1M
7
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XXX
May 2006
Rev. 17
PACKAGE 510: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2U)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
25.15 (0.990) ± 0.25 (0.010) MAX
22.36 (0.880) ± 0.25 (0.010) MAX
20.31 (0.800) REF
0.38 (0.015) ± 0.05 (0.002)
1.27 (0.050) TYP
5.10 (0.200) MAX
0.25 (0.010) ± 0.10 (0.002)
24.0 (0.946)
± 0.25 (0.010)
0.23 (0.009) REF
R 0.127
(0.005)
2O / 9O
1.01 (0.040)
± 0.13 (0.005)
1.37 (0.054) MIN
0.004
PACKAGE 528: 68 LEAD, CERAMIC QUAD FLAT PACK, CQFP (G2L)
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
0.940" TYP
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相关代理商/技术参数
参数描述
WS128K32N-35H1Q 制造商:未知厂家 制造商全称:未知厂家 功能描述:SRAM|128KX32|CMOS|PGA|66PIN|CERAMIC
WS128K32N-35HI 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module
WS128K32N-35HM 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module
WS128K32N-35HQ 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module
WS128K32N-45G2TCE 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MULTICHIP PACKAGE, RADIATION TOLLERANT