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参数资料
| 型号： | WS128K32N-70H1Q |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CPGA66 |
| 封装： | 1.075 X 1.075 MM, CERAMIC, PGA-66 |
| 文件页数： | 8/9页 |
| 文件大小： | 632K |
| 代理商： | WS128K32N-70H1Q |
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White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32-XXX
June 2004
Rev. 4
W S 128K 32 X - XXX X X X
ORDERING INFORMATION
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
Q = MIL-STD-883 Compliant
M = Military Screened -55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to +70°C
PACKAGE TYPE:
H1 = 1.075" sq. Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Prole CQFP (Package 510)
G4T = 40 mm Low Prole CQFP (Package 502)
ACCESS TIME (ns)
IMPROVEMENT MARK:
N = No Connect at pin 8, 21, 28 and 39 in HIP for Upgrades
ORGANIZATION, 128Kx32
User congurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORPORATION
相关PDF资料 |
PDF描述 |
|---|---|
| WS128K32N-100H1IA | 128K X 32 MULTI DEVICE SRAM MODULE, 100 ns, CPGA66 |
| WS128K32N-120H1IA | 128K X 32 MULTI DEVICE SRAM MODULE, 120 ns, CPGA66 |
| WS128K32N-85H1M | 128K X 32 MULTI DEVICE SRAM MODULE, 85 ns, CPGA66 |
| WS128K32N-70G4TCA | 128K X 32 MULTI DEVICE SRAM MODULE, 70 ns, CQFP68 |
| WS128K32N-85G4TC | 128K X 32 MULTI DEVICE SRAM MODULE, 85 ns, CQFP68 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WS128K32N-70H1QA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS128K32N-70HI | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS128K32N-70HM | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS128K32N-70HQ | 制造商:未知厂家 制造商全称:未知厂家 功能描述:x32 SRAM Module |
| WS128K32N-85G2UC | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:128Kx32 SRAM MODULE, SMD 5962-93187 |
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