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参数资料
| 型号： | WS128K32V-17G2TI |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQMA68 |
| 封装： | 22.40 MM, CERAMIC, LQFP-68 |
| 文件页数： | 1/8页 |
| 文件大小： | 296K |
| 代理商： | WS128K32V-17G2TI |
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32V-XXX
128Kx32 3.3V SRAM MODULE
n Commercial, Industrial and Military Temperature Ranges
n 3.3 Volt Power Supply
n Low Power CMOS
n TTL Compatible Inputs and Outputs
n Built-in Decoupling Caps and Multiple Ground Pins for
Low Noise Operation
n Weight
WS128K32V-XG2TX1 - 8 grams typical
WS128K32NV-XH1X - 13 grams typical
WS128K32V-XG1UX - 5 grams typical
*This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
**Commercial and Industrial only.
Note 1: Package Not Recommended For New Design
FEATURES
n Access Times of 15**, 17, 20, 25, 35ns
n MIL-STD-883 Compliant Devices Available
n Low Voltage Operation
n Packaging
66-pin, PGA Type, 1.075 inch square Hermetic
Ceramic HIP (Package 400)
68 lead, Hermetic CQFP (G2T)1, 22.4mm (0.880 inch)
square (Package 509), 4.57mm (0.180 inch) high.
68 lead, Hermetic CQFP (G1U), 23.9mm (0.940 inch)
square (Package 519), 3.56mm (0.140 inch) high.
n Organized as 128Kx32; User Configurable as 256Kx16
or 512Kx8
FIG. 1
PIN CONFIGURATION FOR WS128K32NV-XH1X
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-16
Address Inputs
WE1-4
Write Enables
CS1-4
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
TOP VIEW
BLOCK DIAGRAM
March 2002 Rev. 3
PRELIMINARY*
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| WS128K32V-20G2UIA | 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP68 |
| WS128K32NV-20H1C | 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| WS128K32V-35G2UI | 128K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| WS128K32V-25G2UCA | 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| WS128K32V-17G2UI | 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WS128K32V-17G2TIA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-17G2TM | 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-17G2TMA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-17G2UC | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 17NS, 68 CQFP 0.88" SQ., 0.140" - Bulk |
| WS128K32V-17G2UI | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 17NS, 68 CQFP 0.88" SQ., 0.140" - Bulk |
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