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参数资料
| 型号： | WS128K32V-25G2UCA |
| 厂商： | WHITE ELECTRONIC DESIGNS CORP |
| 元件分类： | SRAM |
| 英文描述： | 128K X 32 MULTI DEVICE SRAM MODULE, 25 ns, CQFP68 |
| 封装： | 22.40 X 22.40 MM, CERAMIC, QFP-68 |
| 文件页数： | 8/8页 |
| 文件大小： | 462K |
| 代理商： | WS128K32V-25G2UCA |
8
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
WS128K32V-XXX
March 2006
Rev. 8
W S 128K 32 X V - XXX X X X
LEAD FINISH:
Blank = Gold plated leads
A = Solder dip leads
DEVICE GRADE:
M = Military Screened
-55°C to +125°C
I = Industrial -40°C to +85°C
C = Commercial 0°C to +70°C
PACKAGE TYPE:
H1 = Ceramic Hex-In-line Package, HIP (Package 400)
G2U = 22.4mm Ceramic Quad Flat Pack, Low Prole CQFP (Package 510)
ACCESS TIME (ns)
LOW VOLTAGE SUPPLY 3.3V ± 10%
IMPROVEMENT MARK:
N = No Connect at pins 8, 21, 28, 39 in HIP for upgrade. (H1 only)
ORGANIZATION, 128Kx32
User congurable as 256Kx16 or 512Kx8
SRAM
WHITE ELECTRONIC DESIGNS CORP.
相关PDF资料 |
PDF描述 |
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| WS128K32V-17G2UI | 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| WS128K32NV-15H1IA | 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CPGA66 |
| WS128K32NV-17H1CA | 128K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CPGA66 |
| WS128K32NV-20H1MA | 128K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CPGA66 |
| WS128K32V-15G2UCA | 128K X 32 MULTI DEVICE SRAM MODULE, 15 ns, CQFP68 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WS128K32V-25G2UI | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 25NS, 68 CQFP 0.88" SQ., 0.140" - Bulk |
| WS128K32V-25G2UM | 制造商:Microsemi Corporation 功能描述:128K X 32 SRAM MODULE, 3.3V, 25NS, 68 CQFP 0.88" SQ., 0.140" - Bulk |
| WS128K32V-25H1C | 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-25H1CA | 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
| WS128K32V-25H1I | 制造商:未知厂家 制造商全称:未知厂家 功能描述:128Kx32 3.3V SRAM MULTICHIP PACKAGE |
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