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参数资料
| 型号： | WS1M32V-17G3IA |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | SRAM |
| 英文描述： | 1M X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP84 |
| 封装： | 28 MM, CERAMIC, QFP-84 |
| 文件页数： | 1/6页 |
| 文件大小： | 309K |
| 代理商： | WS1M32V-17G3IA |
WS1M32V-XG3X
1
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
White Electronic Designs
White Electronic Designs Corp. reserves the right to change products or specications without notice.
February, 2001
Rev. 5
PRELIMINARY*
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25
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28
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32
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9
VCC
A0
A1
A2
A3
A4
A5
A6
OE#1
OE#2
OE#3
OE#4
NC
A7
A8
A9
A10
A11
A12
A13
GND
V
CC
I/O
0
I/O
1
I/O
2
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
CS#
1
NC
CS#
2
I/O
8
I/O
9
I/O
10
I/O
11
I/O
12
I/O
13
I/O
14
I/O
15
GND
NC
WE#4
WE#3
WE#2
WE#1
NC
A18
A17
A16
A15
A14
VCC
GND
I/O
31
I/O
30
I/O
29
I/O
28
I/O
27
I/O
26
I/O
25
I/O
24
NC
I/O
23
I/O
22
I/O
21
I/O
20
I/O
19
I/O
18
I/O
17
I/O
16
V
CC
8 7 6 5 4 3
1 84 83 82 81 80 79 78 77
2
37
38 39 40 41 42 43
45 46 47 48 49 50 51 52 53
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76 75
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34 35 36
1Mx32 SRAM 3.3V MODULE
FEATURES
Access Times of 17, 20, 25ns
84 lead, 28mm CQFP, (Package 511)
Organized as two banks of 512Kx32, User
Congurable as 2Mx16 or 4Mx8
Commercial, Industrial and Military Temperature
Ranges
TTL Compatible Inputs and Outputs
PIN CONFIGURATION FOR WS1M32V-XG3X
PIN DESCRIPTION
I/O0-31
Data Inputs/Outputs
A0-18
Address Inputs
WE#1-4
Write Enables
CS#1-2
Chip Selects
OE#1-4
Output Enables
VCC
+3.3V Power Supply
GND
Ground
NC
Not Connected
TOP VIEW
3.3V Power Supply
Low Power CMOS
Built-in Decoupling Caps and Multiple Ground Pins
for Low Noise Operation
Weight - WS1M32V-XG3X - 20 grams typical
*This product is under development, is not qualied or characterized and is subject to
change without notice.
BLOCK DIAGRAM
8
I/O0-7
CS#1
I/O8-15
CS#2
I/O16-23
I/O24-31
A0-18
WE#1
8
2M x 8
8
512K x 8
8
512K x 8
2M x 8
512K x 8
2M x 8
512K x 8
2M x 8
512K x 8
OE#1
WE#2
OE#2
WE#3
OE#3
WE#4
OE#4
Note: CS#1& CS#2 are used as bank select
The WEDC 84 lead G3 CQFP lls the same t and function as the JEDEC 84 lead
CQFJ or 84 PLCC. But the G3 has the TCE and lead inspection advantage of the
CQFP form.
1.146"
相关PDF资料 |
PDF描述 |
|---|---|
| WS1M8-100CC | 1M X 8 STANDARD SRAM, 100 ns, CDIP32 |
| WS1M8-100CIA | 1M X 8 STANDARD SRAM, 100 ns, CDIP32 |
| WS1M8-70CCA | 1M X 8 STANDARD SRAM, 70 ns, CDIP32 |
| WS1M8-70CC | 1M X 8 STANDARD SRAM, 70 ns, CDIP32 |
| WS1M8-20FMA | 1M X 8 STANDARD SRAM, 20 ns, CDFP36 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WS1M32V-17G3M | 制造商:Microsemi Corporation 功能描述:1M X 32 SRAM MODULE, - Bulk |
| WS1M32V-17G3MA | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3C | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3CA | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3I | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
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