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参数资料
| 型号： | WS1M32V-20G3C |
| 元件分类： | SRAM |
| 英文描述： | 1M X 32 MULTI DEVICE SRAM MODULE, 20 ns, CQFP84 |
| 封装： | 28 MM, CERAMIC, QFP-84 |
| 文件页数： | 5/6页 |
| 文件大小： | 155K |
| 代理商： | WS1M32V-20G3C |
5
White Electronic Designs Corporation (602) 437-1520 www.whiteedc.com
WS1M32V-XG3X
ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES
PACKAGE 511: 84 LEAD, CERAMIC QUAD FLAT PACK (G3)
0.38 (0.015)
± 0.05 (0.002)
4.12 (0.162)
± 0.20 (0.008)
1.27 (0.050) TYP
29.11 (1.146)
± 0.25 (0.010)
25.40 (1.000) TYP
4.29 (0.169)
± 0.28 (0.011)
0.19 (0.008)
± 0.06 (0.003)
1.02 (0.040)
± 0.12 (0.005)
0.25 (0.010)
± 0.03 (0.002)
1
° / 7°
R 0.127
(0.005) MIN
DETAIL A
SEE DETAIL "A"
Pin 1
0.27 (0.011)
± 0.04 (0.001)
+
30.23 (1.190)
± 0.25 (0.010) SQ
27.18 (1.070)
± 0.25 (0.010) SQ
The WEDC 84 lead G3 CQFP fills
the same fit and function as the
JEDEC 84 lead CQFJ or 84 PLCC.
But the G3 has the TCE and lead
inspection advantage of the
CQFP form.
1.146"
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相关代理商/技术参数 |
参数描述 |
|---|---|
| WS1M32V-20G3CA | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3I | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3IA | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3M | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
| WS1M32V-20G3MA | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:1Mx32 SRAM 3.3V MODULE |
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